Electronics and Telecommunications Research Institute

Jeon-Wook Yang

Kwang-Eui Pyun

Chul-Soon Park

Eung-Gie Oh

Byung-Sun Park

Chul-Sun Park

Eung-Gee Oh

This invention provides infrared sensing photodetector and a method therefor which provides a structure for effectively absorbing a light incident in a normal direction on a substrate, and a method compatible with existing processes for making integrated circuitry. An infrared sensing photodetector includes a compound semiconductor substrate of a first conductivity type, superlattice areas having implanted impurity ions of a second conductivity type opposite to the compound semiconductor substrate, each being spaced a predetermined distance each other in a selected region of the semiconductor substrate, a first collector area and a first emitter area which are formed in both end portions positioned perpendicular relative to the doped superlattice areas, a first collector electrode and a first emitter electrode formed on the first collector area and the first emitter area, respectively, a second collector area and a second emitter area which are spaced a predetermined distance in a horizontal direction on the doped superlattice area, and a second collector electrode and a second emitter electrode formed on the second collector area and the second emitter area, respectively.

Infrared photodetector with doping superlattice structure

A method for fabricating a T-shaped gate electrode includes the steps of: forming a fine gate pattern on a semiconductor substrate; forming an insulating layer on the semiconductor substrate on which the gate pattern is formed, and forming a planarizing layer on the insulating layer to planarize the surface of the semiconductor substrate; etching the planarizing layer to expose the top of the insulating layer; isotropically etching the insulating layer to expose the gate pattern using the planarizing layer as a mask; etching the exposed gate pattern to selectively expose the semiconductor substrate; depositing a gate metal to cover the exposed substrate, the insulating layer and the planarizing layer, to form a T-shaped gate; and simultaneously removing the planarizing layer, thereby forming a T-shaped gate metal with improved productivity.

Method for fabricating T-shaped electrode and metal layer having low

A production method for ion-implanted MESFET having self-aligned LDD structure and T-type gate, that the reverse mesa portion is formed at a predetermined part of the channel region which the source and drain regions are formed at both side by using caps layer, the ion is injected between the source and drain regions and the channel region as the small energy and low concentration by using the reverse mesa as the mask, the source and drain regions of the low concentration is formed so that drain part has more broadly than source part, and the gate electrode and the source and drain regions of the low concentration are not contacted at the formed groove which is removed the surface of the reverse mesa portion or the reverse mesa portion.

Growing community of inventors

Daejeon, South Korea

Jeon-Wook Yang