Atotech Deutschland Gmbh

Jens Wegricht

Arnd Kilian

Hans-Jürgen Schreier

Isabel-Roda Hirsekorn

Donny Lautan

Kilian Arnd

Hans Jurgen Schreier

The invention relates to a method for electroless (immersion) plating of tin and tin alloys having a thickness of &#x2267;1 &#x3bc;m as a final finish in the manufacture of printed circuit boards, IC substrates, semiconductor wafers and the like. The method utilizes an electroless plated sacrificial layer of copper between the copper contact pad and the electroless plated tin layer which is dissolved completely during tin plating. The method compensates the undesired loss of copper from a contact pad during electroless plating of thick tin layers.

Method for electroless plating of tin and tin alloys

The present invention relates to method for activating a copper or copper alloy surface for depositing a metal or metal alloy layer by electroless (autocatalytic) plating thereon wherein the formation of undesired voids is suppressed. The copper or copper alloy surface is contacted with palladium ions, at least one phosphonate compound and halide ions followed by electroless (autocatalytic) deposition of a metal such as palladium or a metal alloy such as a Ni&#x2014;P alloy.

Method for activating a copper surface for electroless plating

The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.

Electroless palladium plating bath composition

An autocatalytic tin plating bath containing Snions, Tiions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.

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Berlin, Germany

Jens Wegricht