Qualitau, Inc.

Shockwave Medical, Inc.

Jens Ullmann

Maurice C Evans

Adalberto M Ramirez

Robert J Sylvia

Peter P Cuevas

Gedaliahoo Krieger

Jose Ysaguirre

James Borthwick

Jacob Herschmann

Thomas G Bensing

Robert James Sylvia

Described herein are systems and methods for implementing a power source for a shock wave catheter system, the power source including two separate voltage sources: a bubble generation voltage source and an arc generation voltage source. In one or more examples, the power source can be configured such that the bubble generation voltage source provides a lower voltage to a pair of electrodes of the shock wave catheter system. The lower voltage can be configured to induce electrolysis of a fluid that surrounds the pair of electrodes of the shock wave catheter system for generating and growing a bubble. Once a bubble has formed, the arc generation voltage source can then be engaged to provide a high-voltage electrical pulse to the electrodes of the shock wave catheter system, thereby generating an arc (i.e., spark) across the electrodes.

Catheter system with independently controllable bubble and arc generation

Pulsed current circuitry for electromigration testing of semiconductor integrated circuits and components. The circuit includes a multiplexer that outputs analog voltage pulses, and is capable of generating both bipolar and unipolar voltage pulses. At least one operational amplifier and resistor receive the voltage pulses from the multiplexer and convert the voltage pulses to current pulses. A charge booster circuit is provided for minimizing overshoots and undershoots during transitions between current levels in the test circuit.

Pulsed current source with internal impedance matching

An electronic device under test (DUT) may be incorporated into a circuit having a voltage limiter connected in parallel with the DUT. The circuit includes a controlled current source having an output current connected in series with the DUT. The voltage limiter is characterized in that, when the output current is such that the voltage across the DUT (Vdut) would exceed a particular maximum voltage Vmax, without the voltage limiter in place, at least a portion of the output current flows through the voltage limiter, so as to limit Vdut to be less than or equal to Vmax. When the output current is such that Vdut would be less than or equal to Vmax, current does not flow through the voltage limiter. The circuit may include a plurality of DUTs, each DUT connected in series with the output current of a controlled current source, with a voltage limiter connected in parallel with each DUT.

Electromigration tester for high capacity and high current

A test socket assembly is for use in testing integrated circuits. A single piece socket is formed substantially of an insulating material and having a plurality of holes formed therein configured to receive a plurality of electrically conductive springs. Each hole of the single piece socket has therein a separate one of the electrically conductive springs. A test socket includes a plurality of pins configured to receive leads of an integrated circuit, the pins of the test socket extending into the plurality of holes of the single piece socket with each pin engaging a spring, wherein the single piece socket is positioned on a circuit board with the plurality of holes being in alignment with electrical contacts on the circuit board such that the plurality of springs are electrically interconnecting the contacts and the plurality of pins. The single -piece socket is comprised substantially of a high-temperature insulating material, such as ceramic.

High temperature ceramic socket configured to test packaged semiconductor devices

A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one 'well' location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).

High temperature ceramic die package and DUT board socket

A particular configuration of voltage source measurement (VSM) circuitry minimizes common mode errors in measurement of current through a device under test (DUT), even across a wide range of output voltages. The current Iis not affected by common-mode errors, since the current measurement is based on the output voltage of an operational amplifier or a differential amplifier, and the circuit configuration is such that the current measurement is made while the operation amplifier or differential amplifier has very low common-mode input voltage.

Voltage source measurement unit with minimized common mode errors

A socket for use in testing packaged integrated circuits having leads depending therefrom includes a first member for receiving the integrated circuit package and having a plurality of holes for receiving leads extending from the package. A second member has a plurality of wire contacts for engaging the leads, the first and second members being arranged to permit relative lateral translation thereof. A support frame includes a first portion which physically engages the first member and a second portion which physically engages the second member. A lever or handle is attached to the second portion and includes a cam surface for engaging a cam follower on the first portion for imparting relative lateral motion between the two members whereby the package leads physically engage wires of the second member.

High temperature open ended zero insertion force (ZIF) test socket

A pulsed current generator circuit for providing current pulses to a device under test includes a current source for applying a current to the device under test and a controlled current shunt for shunting current from the device under test. A booster circuit is provided for supplying a booster current to the device under test when the controlled current shunt is opened and current again flows through the device under test, thereby facilitating recharge of a parasitic capacitance associated with the device under test.

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San Jose, CA, United States of America

Jens Ullmann