Siemens Aktiengesellschaft

Jens Schmenger

Hubert Schierling

Bernd Roppelt

Thomas Schwinn

Matthias Nährig

Lutz Namyslo

Klaus Nieberlein

Daniel Kappauf

Roman Kögler

René Junghänel

Falko Baumann

Jennifer Lautner

Stanislav Panicerski

Jürgen Kimpel

Matthias NÄHRIG

A method for determining soiling of a heat sink for cooling an electronic component is disclosed. A load curve controlled by the component and a temperature curve along a heat transfer chain from the at least one component to the heat sink are continuously captured. In a training phase, a decision function is determined, which is provided for application to a portion of the load curve and to at least one correspondingly captured portion of a temperature curve. In a classification phase, a non-soiled state of the heat sink is detected when the portion of the load curve presented to the decision function is similar to the portions of the load curve captured in the training phase and when the at least one corresponding portion of a temperature curve is similar to the portions of the temperature curve in question that were correspondingly captured in the training phase.

Method for determining heat-sink contamination by means of artificial intelligence

In a method for cooling a semiconductor, a time profile of a load of the semiconductor is determined over a predefinable period of time. A cooling apparatus for cooling the semiconductor is controlled or regulated depending on a load cycle of the semiconductor resulting from the determined time profile of the load, and the cooling apparatus is controlled or regulated as a function of the load averaged over the predefinable period of time.

Cooling of semiconductors for optimised service life

A converter unit has a main printed circuit board (MPCB) on which at least one functional module is arranged. By the functional module, at least one AC voltage supplied to the functional module via first power connections of the functional module can be converted into at least two DC voltage potentials output via second power connections. The MPCB has conductor paths via which control signals can be supplied to control connections, and the MPCB has conductor paths which extend from a control unit to first and second control connections of the MPCB and via which the first and second control signals can be supplied to the first and second control connections. The functional module is at least mechanically connected to the MPCB at least in the region of the first and second control connections such that the functional module does not use the first and/or the second control signals.

Flexibly configurable converter units

In a method of manufacturing a power module unit, cooling fins are positioned in recesses of a frame, in particular a metal frame. A first metallic material is applied to the cooling fins and the frame by a thermal spraying process, causing the applied first metallic material to produce a material bond between the cooling fins and the frame.

Method for manufacturing a power module unit

A semiconductor module includes a housing, a pin arranged in the housing and including a first contact region which has a press-fit connection, a semiconductor component arranged in the housing and electrically conductively connected to the pin, and a first substrate arranged in the housing and clamped in the housing via the pin by a non-positive locking connection, which, when formed, causes the press-fit connection to be deformed elastically and/or plastically with the first substrate. The first substrate has a first recess which is open and at least in part encompasses the pin in the first contact region. A metallic coating is applied to the first substrate at least in a region of the first recess so as to electrically conductively connect the first substrate to the semiconductor component, and a second substrate is in contact with the pin and connected within the housing in a non-releasable manner.

Semiconductor module comprising a housing

A power module includes a heat sink, a power unit formed at least partially inside the heat sink and/or on the heat sink and comprising a semiconductor element and a substrate, and a device designed to enclose the power unit and to center a control unit with respect to the power unit. The device includes a frame designed to surround the substrate at least partially, a first projecting section designed to engage in a recess or an opening of the heat sink, and a second projecting section designed to engage in a recess or an opening or a notch of the control unit and to have an outline which when viewed in cross-section is at least essentially star-shaped with at least a first leg, a second leg and a third leg.

Power module

A substrate and a first circuit board each have an upper side and a lower side. The substrate lower side is connected to a cooling body. On the upper side of the substrate, first electronic switching elements connect an alternating current potential at a phase terminal to a high direct current potential at a first potential terminal and to a low direct current potential at a second potential terminal. Second electronic switching elements connect the alternating current potential to a middle direct current potential at a third potential terminal. The substrate is spaced from the first circuit board under the first circuit board lower side. The upper side of the substrate faces toward the first circuit board. The second switching elements are at least on the upper side of the first circuit board, possibly additionally also on the lower side of the first circuit board.

Growing community of inventors

Forchheim, Germany

Jens Schmenger