Lumileds LLC

Koninklijke Philips Corporation N.v.

Oledworks Gmbh

Jens Meyer

Hans-Helmut Bechtel

Ronja Missong

Joerg Feldmann

Antonio Lopez-Julia

Peter Josef Schmidt

Herbert Lifka

Matthias Heidemann

Peter Van De Weijer

Erik Maria Roeling

Stefan Peter Grabowski

Andreas Tücks

Manfred Stephan Ruske

Rainald Manfred Gierth

Marcel Van Gerwen

Hans-Peter Loebl

Helga Hummel

Claudia Michaela Goldmann

Petra Huppertz

Marinus Johannes Petrus Maria Van Gerwen

Niels Jeroen Van Der Veen

Volker Lambert Van Elsbergen

Petrus Cornelis-Paulus Bouten

A layer of multiple phosphor particles is formed on a surface of a substrate, and inorganic material is formed or deposited to embed at least partially the layer of phosphor particles on the substrate. A wavelength-converting layer is thus formed, including the phosphor particles and the inorganic material, that is then separated from the substrate. The inorganic material binds together the phosphor particles so that the wavelength-converting layer is self-supporting. In some examples, before separating the wavelength-converting layer from the substrate, a release member can be adhered to a surface of the wavelength-converting layer opposite the substrate; the wavelength-converting layer can remain adhered to the release member after separation from the substrate. In some examples the wavelength-converting layer can be adhered to a light-emitting surface of a semiconductor light-emitting device.

Self-supporting wavelength-converting phosphor layer

The invention provides a method for providing a luminescent particle with a hybrid coating, the method comprising: (i) providing a luminescent core comprising a primer layer on the luminescent core; (ii) providing a main ALD coating layer onto the primer layer by application of a main atomic layer deposition process, the main ALD coating layer comprising a multilayer with two or more layers having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V; (iii) providing a main sol-gel coating layer onto the main ALD-coating layer by application of a main sol-gel coating process, the main sol-gel coating layer having a chemical composition different from one or more of the layers of the multilayer.

Phosphor particle coating

The invention provides a method for providing a luminescent particle () with a hybrid coating, the method comprising: (i) providing a luminescent core () comprising a primer layer () on the luminescent core (); (ii) providing a main ALD coating layer () onto the primer layer () by application of a main atomic layer deposition process, the main ALD coating layer () comprising a multilayer () with two or more layers () having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V; (iii) providing a main sol-gel coating layer () onto the main ALD-coating layer () by application of a main sol-gel coating process, the main sol-gel coating layer () having a chemical composition different from one or more of the layers () of the multilayer ().

An optical coupling structures are disposed on light output surfaces of semiconductor LEDs of a miniLED or microLED array to facilitate coupling of light emitted by the semiconductor LEDs through the light output surfaces. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LEDs.

Optical coupling layer to improve output flux in LEDs

Embodiments include a device having a micro-LED that includes at least two, individually addressable light emitting diodes on a same substrate; a phosphor converter layer disposed on the micro-LED, the phosphor converter layer including phosphor particles having a D50 of greater than 1 &#x3bc;m and less than 10 &#x3bc;m.

Phosphor layer for micro-LED applications

A particle layer is positioned over a light output surface of a light emitting diode. A transparent protection layer positioned between and in contact with the light output surface and the particle layer. The particle layer comprises a multitude of optically scattering or luminescent particles and a thin coating layer of transparent material coating particles of the multitude. The particles are characterized by a D50 greater than about 1.0 &#x3bc;m and less than about 30. &#x3bc;m; the coating layer has a thickness less than about 0.20 &#x3bc;m. The protection layer is less than about 0.05 &#x3bc;m thick and includes one or more materials different from material of the coating layer. The protection and coating layers can each include one or more metal or semiconductor oxides. Oxide precursor reactivities, with respect to the corresponding light output surface, are less for protection layer material than for coating layer material.

Protection layer for a light emitting diode

Embodiments include a device having a component with a component surface; a phosphor converter body with a phosphor converter body surface facing the component surface; a plurality of particles between and in contact with the component surface and the phosphor converter body surface; and an inorganic coating on and in contact with at least a portion of the particles, at least a portion of the component surface, and at least a portion of the phosphor converter body surface, and a method making such device.

Bonding of phosphor converter emitters

An optical coupling structure is disposed on a light output surface of a semiconductor LED to facilitate coupling of light emitted by the semiconductor LED through the light output surface. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LED.

The invention relates to a substrate () for manufacturing an organic conversion device for converting electrical energy into light energy or light energy into electrical energy, wherein the substrate comprises a) an encapsulation layer () on the substrate, wherein the encapsulation layer includes a first inorganic layer (), a second inorganic layer () and an intermediate organic layer (), and b) a getter reservoir () in contact with the organic layer of the encapsulation layer. Water molecules will therefore not only be transported along the intermediate organic layer, but will also be gathered, especially absorbed, by the getter reservoir, if the encapsulation is damaged. This can slow down a transport of water molecules along a leakage path towards an organic conversion layer of the organic conversion device and hence slow down a possible degradation of the performance of the organic conversion device, if the encapsulation layer is damaged.

Encapsulated organic conversion device with getter reservoir

The present invention relates to an encapsulated semiconductor device () provided on a flexible substrate (), a method of providing an at least partially encapsulated semiconductor device () on a flexible substrate () and a software product for providing an at least partially encapsulated semiconductor device () on a flexible substrate (). In a preferred embodiment, an encapsulation method is presented in which the organic layer () of an inorganic/organic/inorganic multilayer barrier () on a plastic foil () as a substrate is removed at the edges of an OLED (). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (). This enables cuttable OLEDs () that are cut out of a larger plastic substrate () and gives a method to reduce side leakage in OLEDs () that have been manufactured in a roll-to-toll process.

Encapsulated semiconductor device and encapsulation method

The invention relates to an electrical device comprising an electrical unit () like an organic light emitting diode, a protection element () like a thin film encapsulation, which at least partly covers the electrical unit, for protecting the electrical unit against water and/or oxygen, and a detection layer () arranged between the protection element and the electrical unit or within the protection element, wherein the detection layer comprises organic material and is adapted such that a property of the detection layer is changed, if the detection layer is in contact with a contact gas usable for detecting a permeability of the protection element. This allows easily integrating a fast detection test for detecting a permeability of the protection element into a production process for producing the electrical device, i.e. a time consuming external permeability test may not be required.

Electrical device

The invention relates to the field of organic electronic devices () with diffusion barriers and to a method to manufacture such organic electronic devices () to provide an organic electronic device () with excellent performance, which is as stable as possible over time. The organic electronic device () with a substrate (), a first electrode () arranged on top of the substrate () and a functional layer stack (FLS) arranged on top of the first electrode () comprising one or more organic layers () and a second electrode (), wherein the organic electronic device () further comprises at least one essentially transparent and electrically conductive graphene layer () arranged in contact to at least one of the organic layers () acting as a diffusion barrier against diffusion of atoms, ions or molecules into this organic layer ().

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Aachen, Germany

Jens Meyer