Infineon Technologies Ag

Jens Krugmann

Christoph Messelke

Thomas Auer

Andras Bertalan

Arthur Unrau

Ulrich Nolten

Regina Nottelmann

Johannes Uhlig

A housing for a power semiconductor module arrangement includes sidewalls and a lid. The lid includes a first layer of a first material having a plurality of openings, and second layer of a second material that is different from the first material. The second layer completely covers a bottom surface of the first layer. The second layer includes a plurality of protrusions, each protrusion extending into a different one of the plurality of openings of the first layer such that each of the plurality of openings is completely covered by one of the protrusions.

Housing, semiconductor module and methods for producing the same

High-performance semiconductor module

A power semiconductor module includes a substrate having a first side for being arranged to face a heat sink and for being thermally conductively connected to the heat sink, a power semiconductor component arranged on an opposing second side of the substrate, and an electrically insulating housing defining a cavity in which the substrate and the power semiconductor component are accommodated. The housing includes a frame which surrounds the substrate in a frame-like manner, and a hood for being fastened to the heat sink by way of fastening means. The hood includes a pressing die for making contact with the substrate so as to pre-stress the substrate elastically against the heat sink by means of the hood and the pressing die at least when the power semiconductor module is fastened on the heat sink. The frame accommodates the substrate in an interlocking manner and/or is fastened to the substrate.

Power semiconductor module having a two-part housing

Growing community of inventors

Paderborn, Germany

Jens Krugmann