Robert Boschgmbh

Max-Planck-Gesellschaft Zur F&#xf6;rderung Der Wissenschaften E. V.

Jens Hoffmann

Peter Zweigle

Helmut Deringer

Uwe Katzenwadel

Klaus Scheffler

Franco Zeleny

Frank Weishaeutel

Shajan Gunamony

Bernd-Guenter Sippel

Rolf Pohmann

Norbert Krause

Stephan Gaertner

Vahid Seyed-Khoei

Andreas Graessl

Carolin Schlawne

An electrical assembly for a motor vehicle transmission includes a printed circuit board (PCB), at least two contact surfaces, at least two contact elements, and a potting compound. The PCB has a component side and the two contact surfaces are arranged on the component side. The contact elements are each electrically connected by a PCB-side first end portion to one of the contact surfaces. The potting compound is arranged on the component side of the PCB, and the contact elements are partly embedded therein. The potting compound directly contacts the contact surfaces and the PCB-side end portions of the contact elements and covers the same. The contact elements protrude from the potting compound by second end portions facing away from the PCB. The electrical assembly includes a chip protection frame that protrudes outward from the potting compound and forms contact chambers for the second end portions of the contact elements.

Electrical assembly

A method for producing an electronic assembly includes providing a printed circuit board with a first face, a second face facing away from the first face, and a first component arranged on the first face. The method further includes arranging the circuit board such that the second face lies on a reference surface, and applying a sealing material which is substantially not flowable prior to being cured onto the first face. The sealing material surrounds a sub-region of the first face of the circuit board. The method further includes arranging a second component at least partly on the reference surface such that the second component is pressed into the sealing material, electrically connecting the second component to the circuit board via an electric connection line, and applying a covering material onto the circuit board first face sub-region surrounded by the sealing material and onto the first component.

Method for producing an electronic assembly, and electronic assembly, in particular for a transmission control module

The invention relates to an MRI apparatus for magnetic resonance imaging of a subject of investigation, comprising: a coil arrangement () for transmitting an excitation signal into the subject and for receiving a response signal from the subject; a high-power radio-frequency amplifier () for generating the excitation signal; and a low-noise amplifier (LNA) for amplifying the response signal. The invention provides a transmit/receive switch () which is alternatively operable in a transmit mode or in a receive mode. In the transmit mode, the transmit/receive switch () transmits the excitation signal to the coil arrangement () and protects the low-noise amplifier (LNA) from the outgoing excitation signal. In the receive mode, the transmit/receive switch () routes the in coming response signal to the low-noise amplifier (LNA).

Transmit/receive switch, a transmit coil array and a receive coil array for MRI

A position sensor has at least one guide rail for a guide housing having a magnetic component. On the guide housing, an encapsulation is accommodated which electrically insulates and/or fixes a lead frame assembly and/or a circuit trace assembly. It forms a retainer for the magnetic component.

Position sensor

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Stuttgart, Germany

Jens Hoffmann