Infineon Technologies Ag

Siemens Aktiengesellschaft

Qimonda Ag

International Business Machines Corporation

Intel Mobile Communications Gmbh

Intel Deutschland Gmbh

Infineon Technologies Austria Ag

Jens G Pohl

Frank Pueschner

Markus Brunnbauer

Thorsten Meyer

Peter Strobel

Michael Bauer

Gottfried Beer

Rainer Steiner

Hans-Joachim Barth

Holger Woerner

Ludwig Heitzer

Christian Stuempfl

Thomas Spoettl

Harry Hedler

Peter Stampka

Robert-Christian Hagen

Werner Robl

Edward Fuergut

Recai Sezi

Simon Jerebic

Mathias Vaupel

Simon Muff

Klaus Pressel

Ralf Plieninger

Bernd Goller

Stephan Bradl

Johann Winderl

Bernhard Zuhr

Klaus Elian

Irmgard Escher-Poeppel

Alfred Haimerl

Heinrich Koerner

Joern Plagmann

Ulrich Bachmaier

Horst Theuss

Eric Jeffrey White

Roland Irsigler

Christian Hauser

Walther Pachler

Jochen Thomas

Ingo Wennemuth

Ronald R Uttecht

Cyrus Ghahremani

Hermann Vilsmeier

Wolfgang Schindler

Stephen G Starr

Peter Weitz

Albert J Gregoritsch, Jr

Jürgen Högerl

Derek Debie

Andreas Allmeier

Thomas Lehmann

Sheldon C Rieley

Jurgen Grafe

Siegfried Hoffner

Francis E Froebel

Uta Sasse

Monika Bauer

Oliver Wutz

Harold W Conru

Juergen Hoegerl

Carsten Ahrens

Christian Geissler

Oliver Nagy

Marcus Janke

David Tumpold

Matthias Eberl

Daniel Porwol

Michael Huber

Ulrich Wachter

Josef Gruber

Stephan Rampetzreiter

Ralph Domnick

Renate Hofmann

Alexander Glas

Thomas M&uuml;nch

Bernd Roemer

Fabian Merbeler

Mathias Belzner

Ulrich Vidal

Christian Birzer

Herman Vilsmeier

Robert Christian Hagen

Daniel Weiss

Klemens Ferstl

Friedrich Wanninger

Bruno Golz

Harald Widner

Bernhard Schaetzler

Roman Hollweck

Eckehard Miersch

Ekkehard Miersch

Andreas Hippe

Gerolf Thamm

Michael Blumenauer

Michael Schneider

Christian Irrgang

Szabolcs Tompa-Antal

Stephan Brandl

Joem Plagmann

The application relates to a semiconductor device for particle measurement having a cavity housing and a MEMS chip arranged inside the cavity housing. The housing includes a first opening, via which the cavity is connected to the surroundings and in which a first grating is arranged, which is capable by setting it to a first electrical potential of attracting particles from the surroundings and/or electrically charging them. The MEMS chip includes a membrane facing toward the first opening, which is capable by setting it to a second electrical potential of attracting particles. The application furthermore relates to a method for operating a semiconductor device having a cavity housing and a MEMS chip arranged inside the cavity housing.

Semiconductor device for particle measurement and method for operating the semiconductor device

A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

Radiation source device

A chip card body including a metal plate having at least one slot which defines a current flow path on the metal plate, and having a coupling region to accommodate a chip with an antenna, wherein the coupling region is configured to inductively couple the metal plate to the antenna of the chip, a dielectric layer applied to the metal plate, an electrically conductive layer applied to a side of the dielectric layer opposite the metal plate, and at least one electrically conductive coupling between the metal plate and the electrically conductive layer, wherein the metal plate, the dielectric layer and the electrically conductive layer form a capacitor.

Chip card body, method for forming a chip card body and chip card

An electronic inhalation apparatus including a body having a chip module accommodating region which is at least partially surrounded by a folding structure. When a chip module is accommodated in the chip module accommodating region, the folding structure is bent around the chip module in order to fasten the chip module.

Electronic inhalation apparatus with a chip module fixed with a folding structure

A sensor device including a fingerprint sensor and an antenna. The a fingerprint sensor has a silicon-based area sensor, a sensor area, and an electrically conductive contact region arranged laterally adjacent to the sensor area and configured to be touched upon the contact area being touched by a finger in order to bring the finger to a predetermined potential. The antenna is coupled to the fingerprint sensor to inductively couple the fingerprint sensor to a booster antenna.

Sensor device, method for forming a sensor device, carrier tape, chip card and method for forming a chip card

A tank apparatus for an electronic inhaler, including a receptacle configured to hold a liquid to be vaporized, two supply lines configured to apply an electrical supply voltage to an electrical heater, and an authentication circuit configured to authenticate the tank apparatus. The authentication circuit has two supply terminals configured to apply an electrical supply voltage, and at least one of the supply lines is connectable to at least one of the supply terminals in an electrically conductive manner.

Tank apparatus for an electronic inhalation device, electronic inhalation device and method for authenticating a tank apparatus of an electronic inhalation device

A method for trimming an antenna applied on a carrier, the method including pressing a region of the carrier out from a carrier plane of the carrier, the region having a portion of the antenna and the region being selected according to a target property of the antenna, and removing at least a part of the portion of the antenna from the pressed-out region of the carrier.

Method and device for trimming an antenna applied on a carrier, method for producing a carrier structure, carrier structure and chip card

A sensor device is provided that includes a fingerprint sensor and an antenna coupled with the fingerprint sensor for inductive coupling of the fingerprint sensor with a booster antenna.

Sensor device, method of forming a sensor device, chip card and method of forming a chip card

A package including a frame having an opening for receiving a sensor module, wherein the frame comprises at least one electrical connection which is directed into the opening and which is arranged on an insulation layer applied to the frame, and wherein the insulation layer is connected to the frame at an insertion side of the frame, from which side the sensor module is to be inserted into the opening, and is bent along the inner side of the frame proceeding from the insertion side, such that the at least one electrical connection directed to the opening is electrically couplable to the associated sensor module connection in an arrangement.

Package, method for forming a package, carrier tape, chip card and method for forming a carrier tape

Electrical contact

In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.

Smart card module, method for producing a smart card module, smart card and method for testing a smart card module

In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.

Chip card module and method for producing a chip card module

A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.

Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card

A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.

Chip card and method of forming a chip card

A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.

Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card

Growing community of inventors

Bernmardswald-Erlbach, Germany

Jens G Pohl