Other

Formfactor, Inc.

Formfactor Beaverton, Inc.

Jens Fiedler

Stojan Kanev

Claus Dietrich

Frank Fehrmann

Jörg Kiesewetter

Sebastian Gießmann

The invention relates to a method for optically representing electronic semiconductor componentson structural unitsas used for contacting semiconductor components, and to a device which can be used for this purpose. The aim of the invention is to improve navigation on the structural unit. Regarding the structural unitprovided on a holding surfaceof a holding device, a graphical representationof the structural unitor its semiconductor component, or of a section thereof, is provided, and a live imageof the semiconductor componentis displayed on a first display unit. A first graphical representationis also displayed on the first display unitin such a way that elements of the first graphical representation, referred to as overlays, superimpose the live image. The first graphical representationis synchronized with the live imagein a computer-aided manner such that at least one overlaycorresponds to the associated element of the live image

Method and device for optically representing electronic semiconductor components

The invention relates to a method for testing several electronic components () of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck () for holding the components () and special holding devices () for holding individual probes (). For testing, the components () are adjusted to a defined temperature, the probes () and a first electronic component () are positioned relative to each other by means of at least one positioning device, contact pads () of the electronic component () are subsequently contacted by the probes () so that the component () can be tested and then the positioning and the contacting can be repeated for testing another component () of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component () is positioned and contacted by a first positioning step which jointly affects all probes () first being carried out in an intermediate position, in the result of which the component () lies at a defined distance under the probe tips (), the position of each individual probe tip () being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad () to be contacted with the particular probe tip () so that each probe tip () lies above a contact pad (), and the probe tips () further subsequently being brought into contact with the contact pads () of the component () by means of an advancing movement.

Method for testing electronic components of a repetitive pattern under defined thermal conditions

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Dresden, Germany

Jens Fiedler