Advanced Cooling Technologies, Inc.

Jens E Weyant

William G Anderson

Scott D Garner

Michael Dechristopher

Daniel T Reist

Calin Tarau

Andrew J Slippey

Matt D Flannery

James E Schmidt

Jared Tower

E Michael Ames

Daniel Fritch

Ryan Spangler

Matt Schultz

Conor Maghan

A heat spreader including a body having a first conduction value and a first electromagnetic interference shield value. The heat spreader further includes a conduction enhancement affixed to the body, the conduction enhancement having a second conduction value greater than the first conduction value and a second electromagnetic interference shield value less than the first electromagnetic interference shield value. At least a portion of the conduction enhancement is positioned relative to the body for increasing an effective electromagnetic interference shield value of the body associated with the at least a portion of the conduction enhancement.

Heat spreader having conduction enhancement with EMI shielding

An apparatus for dissipating thermal energy including a baseplate including a first body having a first groove and a second groove intersecting one another, the first groove and the second groove formed in and only accessible from a first side of the baseplate. The apparatus including a first heat pipe and a second heat pipe arranged and disposed to provide both an overlapping arrangement and a nonoverlapping arrangement within the first groove and the second groove of the baseplate.

Heat pipes disposed in overlapping and nonoverlapping arrangements

A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.

Assembly and process for heat transfer with three surfaces

A heat pipe device comprising at least two of the following: an axially grooved bore for thermal transport, the axially grooved bore having an axial groove wick; a phase change material bore for thermal storage, the phase change material bore having internal fins to enhance heat transfer, the internal fins extend along the axis of the phase change material bore; and a porous media bore for accepting high heat fluxes, the porous media bore having a porous media wick in areas of high heat flux.

Multi-bore constant conductance heat pipe for high heat flux and thermal storage

A heat pipe assembly that includes at least one axial groove heat pipe and at least one porous media heat pipe. The porous media heat pipe may be embedded into a flange of the axial groove heat pipe, or embedded into a wall of the axial groove heat pipe, or embedded into another bore of the axial groove heat pipe. The evaporator of the at least one porous media heat pipe may be located remotely and can accept a high heat flux, while a condenser of the at least one porous media heat pipe is attached to the axial groove heat pipe.

Constant conductance heat pipe assembly for high heat flux

A card retainer device for securing a card module in a channel of a chassis. The card retainer device includes wedge members which have main portions with integrated brackets integrally attached to the main portions, the integrated brackets form first L-shaped brackets which engage walls of the chassis, surfaces of the card module or a combination thereof. The L-shaped brackets provide bearing surfaces which reduces binding and wear when the card retainer device secures the card module in the channel of a chassis and enhances the conductance of heat through the card retainer device. The wedge members provide heat transfer paths between the card module and the chassis. Mating surfaces of mating wedge member interfaces have compound angles that produces an applied force orthogonal to a flange of the conduction card that is greater than the force applied parallel to the flange of the conduction card.

Card retainer device

The apparatus is a heat transferring clamp with a heat pipe connecting the clamp's stationary base part to each moveable clamping part. A connecting heat pipe section between the heat pipe sections in the base part and each clamping part is flexible enough to permit both the required clamping and unclamping movements of the clamping part. The heat pipes thereby provide a superior heat transfer path between a clamped circuit board or other device and an available heat sink.

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Hershey, PA, United States of America

Jens E Weyant