Corning Incorporated

Jenny Kim

Shandon Dee Hart

Karl William Koch, Iii

James Joseph Price

Robert Alan Bellman

Hannah Shenouda

Mingqian He

Fei Li

Lei Zhang

Nicholas James Smith

James William Zimmermann

Jacob Immerman

Heather Bossard Decker

Joseph Edward McCarthy

Michael Patrick Donovan

Hongxiang Wang

Yanfei Li

Jae-chang Lee

A polymer blend includes an organic semiconductor polymer blended with an isolating polymer; at least one photoinitiator for generating active radicals; and at least one crosslinker comprising C═C bonds, thiols, or combinations thereof, such that the organic semiconductor polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, and the isolating polymer has a non-conjugated backbone. A method of forming an organic semiconductor device having the polymer blend is also presented.

UV patternable polymer blends for organic thin-film transistors

An article is described herein that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.

Glass-based articles having a hard film and a crack mitigating composite structure for retained article strength and scratch resistance

An article that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.

An organic-inorganic composite, including: a discontinuous phase having a plurality of adjacent and similarly oriented fibers of an inorganic material; and a continuous organic phase having a thermoplastic polymer, such that the continuous organic phase surrounds the plurality of adjacent and similarly oriented fibers of the inorganic material, and the organic-inorganic composite is a plurality of adjacent and similarly oriented fibers of inorganic material contained within a similarly oriented host fiber of the thermoplastic polymer. Also disclosed are methods of making and using the composite.

Organic-inorganic composite fibers and methods thereof

A carrier apparatus includes an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an outer edge extending across the thickness between the first major surface and the second major surface. The carrier apparatus includes a coating including a central portion disposed on the first major surface of the article and an outer exposed portion disposed on the outer edge of the article, and a gasket including a first surface contacting the coating. An outer interface between the first surface of the gasket and the coating defines an outer boundary isolating the central portion of the coating from the outer exposed portion of the coating. Methods of processing a carrier apparatus to remove at least a portion of the coating from the article are also provided.

Carrier apparatus and methods of processing a carrier apparatus

Growing community of inventors

Horseheads, NY, United States of America

Jenny Kim