Corning Incorporated

Jenny Kim

Shandon Dee Hart

Karl William Koch, Iii

James Joseph Price

Robert Alan Bellman

Hannah Shenouda

Pushkar Tandon

Timothy Michael Gross

Mingqian He

Lei Zhang

Fei Li

Wendell Porter Weeks

Jason Thomas Harris

Nicholas James Smith

Yousef Kayed Qaroush

James William Zimmermann

Andrew Peter Kittleson

Ying Zhang

Jacob Immerman

Heather Bossard Decker

Joseph Edward McCarthy

Michael Patrick Donovan

Hongxiang Wang

Tingge Xu

Naigeng Chen

Sushmit Sunil Kumar Goyal

Yanfei Li

Jae-chang Lee

Foldable apparatus can comprise a first portion comprising a first edge surface defined between a first surface area and a second surface area opposite the first surface area. Foldable apparatus can comprise a second portion comprising a second edge surface defined between a third surface area and a fourth surface area opposite the third surface area. A polymer-based portion can be positioned between the first blunted edge surface and the second blunted edge surface. In some embodiments, the polymer-based portion can comprise a polymer thickness of about 50 micrometers or less measured from the second surface area and/or the first surface area. In some embodiments, the first edge surface and/or the second edge surface can comprise a blunted edge surface. In some embodiments, a coating can be disposed over the first portion, the second portion and the polymer-based portion.

Foldable apparatus and methods of making

A polymer blend includes an organic semiconductor polymer blended with an isolating polymer; at least one photoinitiator for generating active radicals; and at least one crosslinker comprising C═C bonds, thiols, or combinations thereof, such that the organic semiconductor polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, and the isolating polymer has a non-conjugated backbone. A method of forming an organic semiconductor device having the polymer blend is also presented.

UV patternable polymer blends for organic thin-film transistors

An article is described herein that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.

Glass-based articles having a hard film and a crack mitigating composite structure for retained article strength and scratch resistance

An article that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.

An organic-inorganic composite, including: a discontinuous phase having a plurality of adjacent and similarly oriented fibers of an inorganic material; and a continuous organic phase having a thermoplastic polymer, such that the continuous organic phase surrounds the plurality of adjacent and similarly oriented fibers of the inorganic material, and the organic-inorganic composite is a plurality of adjacent and similarly oriented fibers of inorganic material contained within a similarly oriented host fiber of the thermoplastic polymer. Also disclosed are methods of making and using the composite.

Organic-inorganic composite fibers and methods thereof

A carrier apparatus includes an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an outer edge extending across the thickness between the first major surface and the second major surface. The carrier apparatus includes a coating including a central portion disposed on the first major surface of the article and an outer exposed portion disposed on the outer edge of the article, and a gasket including a first surface contacting the coating. An outer interface between the first surface of the gasket and the coating defines an outer boundary isolating the central portion of the coating from the outer exposed portion of the coating. Methods of processing a carrier apparatus to remove at least a portion of the coating from the article are also provided.

Carrier apparatus and methods of processing a carrier apparatus

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Horseheads, NY, United States of America

Jenny Kim