International Business Machines Corporation

Globalfoundries Inc.

Advanced Technology Materials, Inc.

Jennifer V Muncy

Jon Alfred Casey

Sri Muthuthamby Sri-Jayantha

David L Questad

Arun Sharma

Kenneth Charles Marston

Lorenzo Valdevit

John Anthony Fitzsimmons

Vijayeshwar Das Khanna

Mahmoud M Khojasteh

Timothy Harrison Daubenspeck

Michael Stephen Floyd

Roger Donell Weekly

John Saunders Corbin, Jr

Ian D Melville

David Hirsch Danovitch

Virendra R Jadhav

Sylvain E Ouimet

Marie-Claude Paquet

Eric Salvas

Soraya Ghiasi

Alexandre Blander

Vishal Chhabra

Isabelle Depatie

Roger A Liptak

Ali Afzali-Ardakani

David Clifford Long

William Louis Brodsky

Malcolm Scott Ware

Laertis Economikos

Emanuel Israel Cooper

David L Edwards

James A Busby

Sushumna Iruvanti

Bruce John Chamberlin

Nicholas C M Fuller

Peter Jeffrey Brofman

Thomas J Fleischman

Karl E Boggs

George Gabriel Totir

Robin A Susko

Erwin B Cohen

James Hannah

Martin P Goetz

Scott A Cummings

Michael J Griffin, Iv

Malcom S Ware

Vijayeshwar D Kharma

Michael W Owens

James L Simpson

An electronic module includes a substrate including at least one structure that reduces stress flow through the substrate, wherein the structure includes at least one trench in a surface of the substrate, and a plurality of capacitor legs disposed on an upper surface of the substrate.

Electronic components on trenched substrates and method of forming same

Cleaning solutions and processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an acidic aqueous cleaning solution free of a fluorine containing compound, the acidic aqueous cleaning solution including at least one antioxidant and at least one non-oxidizing acid.

Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof

An electronic package has a cover or lid mounted onto a substrate to enclose an electronic device, and a liquid thermal interface material is subsequently inserted (through dispensing, injection molding or printing through apertures in the cover or lid) between the surface of the electronic device and the cover, and cured to a solid state.

Method of making an electronic package

A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.

Passivation layer surface topography modifications for improved integrity in packaged assemblies

An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.

Cleaning processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an antioxidant to form an insoluble adduct followed by solubilizing the adduct with a basic aqueous cleaning solution.

Process for cleaning semiconductor devices and/or tooling during manufacturing thereof

An aqueous solution of a cerium (IV) complex or salt having an extended lifetime is provided. In one embodiment, the extended lifetime is achieved by adding at least one booster additive to an aqueous solution of the cerium (IV) complex or salt. In another embodiment, the extended lifetime is achieved by providing an aqueous solution of a cerium (IV) complex or salt and a cerium (III) complex or salt. The cerium (III) complex or salt can be added or it can be generated in-situ by introducing a reducing agent into the aqueous solution of the cerium (IV) complex or salt. The aqueous solution can be used to remove a mask material, especially an ion implanted and patterned photoresist, from a surface of a semiconductor substrate.

Aqueous cerium-containing solution having an extended bath lifetime for removing mask material

A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Achieving mechanical and thermal stability in a multi-chip package

Mitigating effects of delamination of components in the data processing system is provided. A signal is received from one or more sensors in the data processing system. A determination is made as to whether the signal indicates that one threshold in a plurality of thresholds has been reached or exceeded. Responsive to the signal indicating that one threshold in the plurality of thresholds has been reached or exceeded, a determination is made as to whether the one threshold is a low temperature threshold or a high temperature threshold. Responsive to the one threshold being a low temperature threshold, one of a plurality of actions is initiated to increase a temperature of the data processing system thereby mitigating effects of delamination of the components in the data processing system.

Enhanced thermal management for improved module reliability

Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.

Tracking thermal mini-cycle stress

A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

Thermal pillow

Growing community of inventors

Ridgefield, CT, United States of America

Jennifer V Muncy