3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Hydro-quebec

Other

3m Innovative Properties

Jennifer L Trice

Michael K Domroese

Joseph Andrew Hoffman

Charles N DeVore

Roger Rouillard

David D Lindeman

Vern E Radewald

Robert A Yapel

Robert B Secor

Keith R Bruesewitz

William J Kopecky

Kristopher K Biegler

Pentti K Loukusa

Paul C Thomas

Michel Gauthier

Thomas A Turgeon

Terence D Neavin

Anthony Sudano

Michel Ranger

Jean Rouillard

Toshimi Shiota

Joseph-Robert-Gaetan Noel

Michael W Lovejoy

Joseph-Robert-Ga&eacute;tan No&euml;l

James M Nelson

Satinder K Nayar

Timothy L Hoopman

Ming-Lai Lai

Alan B Campbell

Dale L Ehnes

William J Bryan

Ronald W Gerdes

Ethan B Secor

Bert A Ross

Nelson D Sewall

William R Dudley

Greg E Schrank

John R Damewood

Donald S Oblak

Andrew W Chen

Peihui Zhang

Jill R Menzel

Richard C Kerr

L Charles Hardy

Gregory D Kostuch

Timothy J Rowell

Gopal B Haregoppa

James R Starkey

Jeffrey E Clements

Bruce D Shalles

Philippe St-Germain

Michael J Tichy

Richard J Foss

Michael R Harms

Andrzej P Jaworski

Eddie L Jarvis

Verlin W Schelhaas

A rotary acoustic horn. The rotary acoustic horn includes a shaft having an axial input end and an axial output end; and at least one welding portion; wherein the welding portion comprises an outer weld face that expands and contracts with the application of acoustic energy; wherein the welding portion comprises a first opposing end portion and a second opposing end portion; wherein the welding portion comprises through holes extending substantially along an axial direction of the welding portion from the first opposing end portion to the second opposing end portion; and wherein the through holes are located between the weld face and the shaft.

Rotary acoustic horn

A method of controlling a slot die comprises, while continuing to pass the extrudate through the fluid flow path and out the applicator slot, changing the position of the actuators with the controller to either increase the cross-directional thickness of the fluid flow path adjacent each of the actuators or substantially close the fluid flow path adjacent the actuators, and after changing the cross-directional thickness of the fluid flow path adjacent each of the actuators, while continuing to pass the extrudate through the fluid flow path and out the applicator slot, repositioning each of the actuators with the controller according to the set of discrete settings to resume operating the slot die with the actuators positioned according to the set of discrete settings.

Slot die position adjustment and return to baseline

A system comprises a slot die including an applicator slot extending about a width of the slot die, wherein the applicator slot is in fluid communication with a fluid flow path through the slot die, and a plurality of actuators spaced about the width of the slot die, wherein each actuator in the plurality of actuators is operable to adjust a cross-directional thickness of the fluid flow path at its respective location to provide a local adjustment of fluid flow through the applicator slot. The system further comprises a controller configured to set the position of each actuator according to one of a plurality of discrete settings for operation of the slot die. The controller is further configured to, using fluid dynamics and a digital model of the die, predict a set of discrete settings from the plurality of discrete settings corresponding to a preselected cross-web profile for the extrudate.

Slot die position adjustment control

A method of controlling a slot die comprises positioning actuators of the slot die with a controller according to a first set of discrete settings, operating the slot die by passing an extrudate through the fluid flow path and out the applicator slot with the actuators positioned according to the first set of discrete settings, and while passing the extrudate through the fluid flow path and out the applicator slot, changing the positions of the actuators with the controller to create patterned features in the extrudate.

Slot die position adjustments to facilitate patterned products

Computer implemented method for making a die includes: selecting coating uniformity required to produce a particular coated product with the die and a value for one or more dimensions of the die; determining (using a mathematical model determined by regression analysis) total indicated run-out (TIR) of a die surface and dimensions of the die not having a user specified value; and machining die part or parts to the determined TIR and dimensions. A thermal treatment process for reducing the number of finishing (e.g., grinding) cycles needed to produce a desired die flatness is provided. A coating fluid rheological characteristic can be an input to the method.

System and method for designing a die to yield a desired coating uniformity

A cutting tool assembly using a machined tool operating in a plunge mode of electrical discharge machining to make microreplicated features in a work piece having a complex surface. The microreplicated features can be non-adjacent and can have any geometric configuration and micron-scaled dimensions, as determined by the microstructured features in the tool. The machined work piece can be used as a master tool in order to make microreplicated articles such as optical films, friction control films, plasma display panel molds, or micro-fasteners.

Microreplication on a complex surface

A method includes placing a conductive mold in a first bath of electroforming solution, the solution including metal and having a selected temperature. A current is provided to the electroforming solution so that metal deposits onto the mold, thereby forming an electroformed element on the mold, the electroformed element and the mold being a composite assembly. The method further includes removing the composite assembly from the electroforming solution and transferring the composite assembly to a second bath having the same selected temperature. Thereafter, the electroformed element is separated from the mold while the composite assembly is in the second bath.

Dimensional control in electroforms

Methods and apparatus for orthodontic treatment planning that involve determining an initial position of an orthodontic structure, determining an altered position, and generating response surface data using a mathematical relationship between the positions. The mathematical relationship may be defined by a number of parameters useful for determining one or more of the stress, strain, force, and moment associated with movement of the orthodontic structure. The mathematical relationship between the initial position and the altered position may be defined using a finite element analysis, empirically determined, or using other computational methodologies such as a finite difference methodology. The mathematical relationship may also be defined using an analytical methodology, such as elasticity and/or plasticity methodologies. Response surface data may be generated as a teaching aid, treatment planning aid, table, or other useful form, which may be useful, for example, for designing an orthodontic appliance, verifying an orthodontic prescription, and/or planning the prescription.

Response surfaces for orthodontic treatment planning

The disclosure is directed to a cutting tool assembly used for creating grooves in a microreplication tool. The cutting tool assembly includes a mounting structure and multiple diamonds aligned in the mounting structure to a tolerance of less than 10 microns. For example, first and second tool shanks having first and second diamond tips can be positioned in the mounting structure such that a cutting location of the first diamond tip is identical to a cutting location of the second diamond tip. However, the second diamond tip may be a defined distance further away from the mounting structure than the first diamond tip, or the second diamond tip may have a different shape than the first diamond tip. In this manner, the first diamond tip may cut a groove into a work piece and the second diamond tip may cut a sub-feature into the groove to create a multi-featured groove.

Aligned multi-diamond cutting tool assembly for creating microreplication tools

In one embodiment, a cutting tool assembly used for creating grooves in a microreplication tool is described. The cutting tool assembly includes a mounting structure and multiple diamonds mounted in the mounting structure. For example, first and second tool shanks having first and second diamond tips can be positioned in the mounting structure such that a cutting location of a diamond cutting tip of the first tool shank is a defined distance from a cutting location of a diamond cutting tip of the second tool shank. The defined distance may correspond to an integer number of pitch spacings, and may be accurate to within a tolerance of less than approximately 10 microns.

Multi-diamond cutting tool assembly for creating microreplication tools

The invention is directed to a cutting tool assembly that include multiple diamonds to define multiple cutting tips. A first diamond is positioned in the cutting tool assembly to create a first groove in a microreplication tool and a second diamond is positioned in the cutting tool assembly to create a second groove the microreplication tool, wherein the first and second grooves define integer pitch spacing of a microreplication structure to be created using the microreplication tool. In addition, a third diamond is positioned in the cutting tool assembly between the first and second diamonds to create a land feature in the microreplication tool between the first and second grooves. The invention can improve land feature creation by using a third diamond tip, rather than leaving the land features untooled and defined by the original untooled surface of micro-replication tool.

Cutting tool assembly including diamond cutting tips at half-pitch spacing for land feature creation

An improved electrochemical generator is disclosed. The electrochemical generator includes a thin-film electrochemical cell which is maintained in a state of compression through use of an internal or an external pressure apparatus. A thermal conductor, which is connected to at least one of the positive or negative contacts of the cell, conducts current into and out of the cell and also conducts thermal energy between the cell and thermally conductive, electrically resistive material disposed on a vessel wall adjacent the conductor. The thermally conductive, electrically resistive material may include an anodized coating or a thin sheet of a plastic, mineral-based material or conductive polymer material. The thermal conductor is fabricated to include a resilient portion which expands and contracts to maintain mechanical contact between the cell and the thermally conductive material in the presence of relative movement between the cell and the wall structure. The electrochemical generator may be disposed in a hermetically sealed housing.

Method for transferring thermal energy and electrical current in thin-film electrochemical cells

An in-situ thermal management system for an energy storage device. The energy storage device includes a plurality of energy storage cells each being coupled in parallel to common positive and negative connections. Each of the energy storage cells, in accordance with the cell's technology, dimensions, and thermal/electrical properties, is configured to have a ratio of energy content-to-contact surface area such that thermal energy produced by a short-circuit in a particular cell is conducted to a cell adjacent the particular cell so as to prevent the temperature of the particular cell from exceeding a breakdown temperature. In one embodiment, a fuse is coupled in series with each of a number of energy storage cells. The fuses are activated by a current spike capacitively produced by a cell upon occurrence of a short-circuit in the cell, thereby electrically isolating the short-circuited cell from the common positive and negative connections.

In-situ short-circuit protection system and method for high-energy electrochemical cells

A family of working liquids useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working liquids, and semiconductor wafers made according the foregoing process. The working liquid of the invention is a solution of initial components, the components comprising: an oxidizing agent; an ionic buffer; a passivating agent; a chelating agent selected from iminodiacetic acid and salts thereof; and water. The method of the invention comprises the steps of: a) providing a wafer comprising a first material having a surface etched to form a pattern and a second material deployed over the surface of the first material; b) contacting the second material of the wafer with abrasive in the presence of the working liquid; and c) relatively moving the wafer while the second material is in contact with the abrasive until an exposed surface of the wafer is planar and comprises at least one area of exposed first material and one area of exposed second material.

Working liquids and methods for modifying structured wafers suited for semiconductor fabrication

Growing community of inventors

Hugo, MN, United States of America

Jennifer L Trice