International Business Machines Corporation

Jennette E Kingsley

David Noel Light

Richard A Schumacher

Kathleen L Covert

Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having copper circuitization on a dielectric substrate. The method includes depositing copper on opposite surfaces of the package, and then depositing resist atop the copper. The resist is patterned, e.g., by photolithography or screening so that intended circuitization traces are covered by the resist. The exposed copper is etched, and the resist is stripped off of the unexposed copper. The process is characterized in that the etchant is upwardly sprayed onto a downwardly facing first surface of the package for half of the etching cycle, and then the package is rotated so that etchant is upwardly sprayed onto the downwardly facing second surface of the package.

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Vestal, NY, United States of America

Jennette E Kingsley