Palo Alto Research Center Inc.

Xerox Corporation

Jengping Lu

Eugene Michael Chow

David Kalman Biegelsen

Sourobh Raychaudhuri

Anne Plochowietz

Gregory Lewis Whiting

Julie A Bert

Christopher L Chua

Janos Veres

Yunda Wang

Jamie Kalb

Ashish V Pattekar

Bradley Rupp

Qian Wang

Warren Bruce Jackson

Carolyn Patricia Moorlag

Matthew Adam Shreve

George Amos Gibson

Jason Donald Thompson

Sean Roark Garner

Eugene S Beh

Lara S Crawford

Scott J H Limb

Sergey Butylkov

Nan-Xing Hu

Robert Anthony Street

Raj B Apte

Patrick Yasuo Maeda

Armin R Volkel

Bing R Hsieh

Joerg Martini

Rene A Lujan

Thomas Wunderer

Dirk De Bruyker

Scott J Limb

Ping Mei

Noble Marshall Johnson

Palghat Srinivas Ramesh

Kent J Evans

Timothy D Stowe

Alan G Bell

Tse Nga Ng

Philipp Helmut Schmaelzle

Brent Shawhan Krusor

Gregory B Anderson

Ramkumar Abhishek

Mandana Veiseh

Norine E Chang

Dirk DeBruyker

Felicia Linn

Veiseh Mandana

A micro-assembly system includes a reservoir that stores a supply of chiplets suspended in a suspension fluid. Each of the chiplets has a bottom major surface that defines a right side down orientation. The system includes a delivery surface or belt that delivers the chiplets from the reservoir to an assembly surface. The system includes a micro assembler that may arrange the first subset of the chiplets in a pattern on the assembly surface. The micro assembler moves the first subset of chiplets towards a subsequent assembly stage. The micro assembler has an array of field generators fixed relative to the assembly surface that move the first subset of the chiplets along the assembly surface in response to signals applied to each of the field generators.

Chiplet loader for microassembler

Disclosed herein are techniques for transferring particles in a pattern. In one implementation, a particle-transferring system includes a first substrate comprising a first surface configured to support a plurality of particles in a non-uniform pattern, and a particle transfer unit configured to remove the plurality of particles from the first surface in response to the plurality of particles being within a first gap. The system also includes a second substrate configured to remove the plurality of particles from the particle transfer unit and secure the plurality of particles to the second surface in response to the plurality of particles being within a second gap. The particle transfer unit is configured to transfer the plurality of particles and maintain the non-uniform pattern regardless of the positions of the plurality of particles, which are not predefined to fit features of the particle transfer unit.

High registration particles-transferring system

First and second chiplets are positioned along a surface to respectively cover first and second electrodes. The first electrode is activated to cause an attraction force between the first electrode and the first chiplet. The second electrode is deactivated allowing the second chiplet to rotate on the surface. While the first electrode is activated and the second electrode is deactivated, a rotation field is applied to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.

Micro assembler with fine angle control

A device includes a first transistor having a first source, a first gate, a first drain, and one or more electrodes. The first transistor serves as an inverter. The device also includes a second transistor having a second source, a second gate, and a second drain. The first and second sources are connected together. The first and second drains are connected together. The second transistor serves as an output, a driver, or both. The one or more electrodes, the second gate, or a combination thereof serve as tapped drains that are configured to sample a stepped voltage of the second transistor.

Switching device for driving an actuator

A transistor includes a first layer comprising a group III-nitride semiconductor. A second layer comprising a group III-nitride semiconductor is disposed over the first layer. A third layer comprising a group III-nitride semiconductor is disposed over the second layer. An interface between the second layer and the third layer form a polarization heterojunction. A fourth layer comprising a group III-nitride semiconductor is disposed over the third layer. An interface between the third layer and the fourth layer forms a pn junction. A first electrical contact pad is disposed on the fourth layer. A second electrical contact pad is disposed on the third layer. A third electrical contact pad is electronically coupled to bias the polarization heterojunction.

Polarization controlled transistor

A heating circuit having an array of switching heating elements (e.g., field effect transistors, thin film transistors) provides a transient heat pattern over a surface (e.g., substrate, imaging member surface, transfer roll surface) moving relative to the heating circuit, to produce a pixelated heat image and heat a target pattern on the surface. Heat is generated by current flow in the heating elements, and the power developed by the heating circuit is the product of source-drain voltage and current in the channel. Digital addressing may accomplished by matrix addressing the array. Current may be supplied along data address lines by an external voltage controlled by digital electronics understood by a skilled artisan to provide the desired heat at a respective heating element pixels addressed by a specific gate line. The circuit may include a current return line that may be low resistance, for example, by using a 2-dimensional mesh.

Heat image forming device and method

A printing system for producing at least one three dimensional (3D) printed part is described. The printing system includes a deposition system configured to continuously deposit a layer onto a cylinder to outwardly extend a diameter of the cylinder, wherein the layer comprises a first pattern. The printing system also includes a rotating system configured to rotate the cylinder, and a control system configured to synchronize the deposition system with the cylinder.

Apparatus for continuous high-speed 3D printing

A method of providing high-speed three dimensional (3D) printing is described. The method includes producing at least one three dimensional (3D) printed part. Producing the 3D part includes continuously constructing to extend outwardly a diameter of a rotating cylindrical core via continuous deposition of a layer, and defining a first pattern in the continuously deposited layer corresponding to a cross-section of the at least one 3D printed part.

Method of continuous high-speed 3D printing

Ink-based digital printing systems useful for ink printing include a secondary roller having a rotatable reimageable surface layer configured to receive fountain solution. The fountain solution layer is patterned on the secondary roller and then partially transferred to an imaging blanket, where the fountain solution image is inked. The resulting ink image may be transferred to a print substrate. To achieve a very high-resolution (e.g., 1200-dpi, over 900-dpi) print with these secondary roller configurations, an equivalent very high-resolution fountain solution image needs to be transferred from the secondary roller onto the imaging blanket. To increase the resolution of the image on the secondary roller, examples include a textured surface layer added to the secondary roller for contact angle pinning the fountain solution on the roll. Approaches to introduce a micro-structure onto the surface layer of the secondary roller, and also superoleophobic surface coatings are described.

Secondary roller for fountain solution contact angle pinning

Based on evaporation of fountain solution from a rotating blanket cylinder to create an image that may be inked and printed, a digitally addressable heater array at or just below the blanket surface evaporates deposited fountain solution and forms a fountain solution latent image on the surface. The heater array has controllable heating elements (e.g., field effect transistors, thin film transistors) that provide a transient heat pattern on the surface to evaporate the fountain solution. Heat is generated by current flow in the heating elements, and power developed by the heating circuit is the product of source-drain voltage and current in the channel. Current may be supplied along data lines by an external voltage controlled by digital electronics to provide the desired heat at heating elements addressed by a specific gate line. The heater array may include a current return line that may be a 2-dimensional mesh.

Matrix-addressed heat image forming device

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

Method of controlling the placement of micro-objects on a micro-assembler

Systems and methods for constructing 3-dimensional (3D) parts are disclosed. A printing system may include a deposition system configured to print a plurality of 2-dimensional (2D) layers onto a plurality of carrier sheets. The printing system also includes a transferring system configured to transfer a 2D layer from a carrier sheet of the plurality of carrier sheets, onto the 3D part. The 3D part may be located on a base substrate. The printing system further includes a feed system configured to provide the plurality of carrier sheets from the deposition system to the transfer system in a successive fashion while maintaining the directionality of printing in the deposition and transferring systems.

Constructing 3-dimensional parts using electrophotography

Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.

Apparatus for controlling the placement of micro-objects on a micro-assembler

A device includes a first stage having a first optical switch, a first transistor connected to the first optical switch, and a second transistor connected to the first optical switch and the first transistor. The device also includes a second stage having a second optical switch, a third transistor connected to the second transistor and the second optical switch, and a fourth transistor connected to the second transistor, the second optical switch, and the third transistor.

Scalable high-voltage control circuits using thin film electronics

Growing community of inventors

Fremont, CA, United States of America

Jengping Lu