National Science Council

Other

Jeng-Yueh Shieh

Chun-Shan Wang

Ching Hsuan Lin

The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cured flame retardant epoxy resin is environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications. The phosphorus group of the curing agent has a chemical structure as follows:wherein Ar is a substituted or un-substituted phenyl or phenoxy.

Phosphorus-containing flame-retardant hardener, and epoxy resins cured by the same

The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.

Phosphorus-containing flame-retardant hardeners, epoxy resins, advanced epoxy resins and cured epoxy resins

A method for imparting flame retardance to an epoxy resin comprises reacting an epoxy resin with a phosphorus-containing dihydric phenol or naphthol derived from the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (i.e., DOPO) with a benzoquinone or naphthoquinone.

Reacting epoxy resin with p-containing dihydric phenol or naphthol

Phosphorus-containing phenolic, thiophenolic or aminophenyl flame-retardant hardener, and epoxy resins cured thereby

Flame-retardant advanced epoxy resins and cured epoxy resins contain a rigid phosphorus group emanating from a dihydric phenol or naphthol which provides thermal and flame retardant properties. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications.

Growing community of inventors

Tainan, Taiwan

Jeng-Yueh Shieh