Industrial Technology Research Institute

Jeng-Yu Tsai

Jyh-Long Jeng

Wei-Ta Yang

Jinn-Shing King

Shur-Fen Liu

Jhy-Long Jeng

Chih-Ming Hu

Charng-Shing Lu

Chin-Ching Lin

Wen-Ching Sun

Chen-Hsi Cheng

Yen-Yi Chu

Yu-Chun Chen

Chi-En Kuan

Yi-Syuan Wang

An anhydride compound, polyimide, and thin film are provided. The anhydride compound has a chemical structure of wherein Ris each of Ris independently Calkylene group, m is an integer of 0 to 10, and m' is an integer of 1 to 10; n is an integer of 1 to 10, each of Ris independently hydrogen, saturated or unsaturated Chydrocarbon group, CF, silanol group, silyl group, or Al(OH); and Ris silanol group, silyl group, or Al(OH). The anhydride compound can be reacted with a diamine compound to form a polyimide.

Anhydride compound, polyimide, and thin film

A compound, a resin composition and a laminated substrate thereof are provided. The compound has a structure represented by Formula (I) wherein Ais Calkylene group, Calkenylene group, Calkynylene group, Calicyclic alkylene group, Calicyclic alkenylene group, or Calicyclic alkynylene group. Ais Calkylene group, C-Carylene group with two reactive groups, Ccycloalkylene group, Cheteroarylene group, divalent C-Calkylaryl group, divalent Cacylaryl group, divalent Caryl ether group, or divalent Cacyloxyaryl group; and, n&#x2265;1.

Compound, resin composition and laminated substrate thereof

A composition, an insulating material, and a method for preparing an insulating material are provided. The composition includes (a) 100 parts by weight of oligomer of Formula (I) (b) 20-50 parts by weight of polymer having at least two reactive functional groups, wherein the reactive functional group is a reactive-double-bond-containing functional group; (c) 1-5 parts by weight of photoinitiator; (d) 0.5-2 parts by weight of thermal initiator; and (e) 0.5-2 parts by weight of photoacid generator.

Composition, insulating material, and method for preparing an insulating material

A solventless resin composition with a low dielectric constant and a substrate structure are provided. The composition includes: (a) 20-50 parts by weight of a copolymer having the structure of Formula (I)  (c) 80-100 parts by weight of a hardener; and (d) 70-100 parts by weight of an inorganic filler.

Low dielectric constant and solventless resin composition and substrate structure

A polymer, a method for preparing the same, and a photosensitive resin composition thereof are provided. The polymer has a structure represented by Formula (I): wherein Ris &#x2014;OH, or &#x2014;COOH; Ais each Ais independently each Ais independently Z is &#x2014;O&#x2014;, &#x2014;S&#x2014;, &#x2014;C(CH3)2-, &#x2014;C(CF3)2-, m is a positive integer that is greater than 1; n is a positive integer that is greater than 1; i is a positive integer between 1 and 3; and, j is a positive integer between 1 and 20; and, the repeat units are arranged in a random fashion.

Polymer, method for preparing the same, and a photosensitive resin composition thereof

A polyimide copolymer represented by formula (I) or formula (II) is provided.  In formula (I) or formula (II), B is a cycloaliphatic group or aromatic group, A is an aromatic group, R is hydrogen or phenyl, and m and n are 20-50. The invention also provides a method for fabricating a patterned metal oxide layer.

Polyimide copolymers and method for fabricating patterned metal oxide layers

A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of Rand R, independently, is a Csaturated or an unsaturated carbon chain, Ris ether, phenyl, a Cheterocyclic or Csaturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

Thermally curable solder resist composition

The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C&#x2550;C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.

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Chiayi, Taiwan

Jeng-Yu Tsai