Taiwan Semiconductor Manufacturing Comp. Ltd.

Jeng-Shieh Hsieh

Chen-Hua Douglas Yu

Chuei-Tang Wang

Chung-Hao Tsai

Monsen Liu

A semiconductor device includes an active device. The semiconductor device further includes a plurality of antenna grounds electrically connected to the active device. The semiconductor device further includes a plurality of patch antennas, wherein each patch antenna of the plurality of patch antennas is over a corresponding antenna ground of the plurality of antenna grounds. The semiconductor device further includes a plurality of reflectors, wherein each antenna ground of the plurality of antenna ground is between a corresponding patch antenna of the plurality of patch antennas and a corresponding reflector of the plurality of reflectors. An area of each antenna ground of the plurality of antenna grounds is greater than an area of each reflector of the plurality of reflectors.

Semiconductor device including integrated fan out antenna and method of forming the same

An integrated fan out (InFO) antenna includes a reflector on a surface of a substrate; and a package. The package includes a redistribution layer (RDL) arranged to form an antenna ground, and a patch antenna over the RDL, wherein the RDL is between the patch antenna and the reflector. The InFO antenna further includes a plurality of connecting elements bonding the package to the reflector. Each connecting element of the plurality of connecting elements is located inside an outer perimeter of the reflector. The InFO antenna is configured to output a signal having a wavelength.

Integrated fan out antenna and method of forming the same

An antenna comprises a first layer having a first redistribution layer, a feeding line, a ground connection element, and one or more antenna inputs. The antenna also comprises one or more intermediate layers over the first layer. The antenna further comprises a second layer having a second redistribution layer over the one or more intermediate layers. The antenna additionally comprises one or more through vias arranged to communicatively couple the second redistribution layer and the first redistribution layer. The antenna also comprises a short element. The antenna further comprises one or more radiator antennas within the one or more through vias, the one or more radiator antennas being in communication with the one or more antenna inputs by way of the feeding line.

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Kaohisung, Taiwan

Jeng-Shieh Hsieh