Hon Hai Precision Industry Co., Ltd.

Hong-fu Jin Precision Industry (shenzhen) Co., Ltd.

Hongfujin Precision Industry (wuhan) Co., Ltd.

Jeng-Da Wu

Yu-Hsu Lin

Chih-Hang Chao

Hui Zhang

Liang-Liang Cao

Zhi-Ping Wu

Lei Guo

Liang-Qing Shan

Qin Li

Fu-Ming Liu

Chun-Ming Chen

Chan-Fei Tai

A speaker includes a shell and a vibration device. The vibration device is fixed on the shell. The shell defines a closed space. The closed space is filled with gas. The vibration device can drive the shell to vibrate to produce sound. A speaker is also provided.

Housing of electronic device and speaker

A method for laying out a circuit board includes following steps. A substrate board is formed with a plurality of board sides. A ground plane, including a plurality of tiles, is provided. Each ground trace tile is defined by a plurality of ground traces. A signal plane on the substrate board has a plurality of signal traces that comprise of a plurality of straight line segments. Any one ground trace of each tile is arranged at an angle other than zero degrees relative to one determined board side. The straight line segments is applied to be mapped on the ground plane crossing one ground trace of one tile within an angle range determined by the ground traces of the tile and an adjacent diagonal line of the tile. The one ground trace and the straight line segments are applied at an angle movable in a range from 22.5&#xb0; to 32.5&#xb0;.

Circuit board layout method

A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.

Motherboard

A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers.

Printed circuit board

The invention related to a method and circuit that is used to compensate for S-parameters of a passive circuit which do not satisfy passivity. The method includes the following steps: (1) getting S-parameters which do not satisfy passivity, these S-parameters being composed of an S-parameter matrix S; (2) computing matrix [S&#xd7;S'], wherein matrix S&#x2032; is a complex conjugate transposed matrix of the S-parameter matrix S; (3) computing the eigenvalues of the matrix [S&#xd7;S&#x2032;], and choosing an eigenvalue &#x3a8; whose real part real(&#x3a8;) is the biggest; (4) computing a compensating value &#x3be;, the compensating value &#x3be; being equal to real(&#x3a8;)&#xd7;(1+&#x3b5;), wherein the &#x3b5; is a very small positive number; and (5) dividing each of the S-parameters by the compensating value &#x3be; to get the compensated S-parameters.

Method and apparatus for compensating S-parameters of passive circuits

A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.

Heat dissipation apparatus

A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.

Circuit board assembly

A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Computer enclosure with airflow guide

A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch.

Button assembly

An electronic apparatus includes an enclosure (), a circuit board (), a fan module (), and an air guiding element () mounted in the enclosure. The circuit board includes at least one heat generating component () thereon. The fan module has a fan () and an output opening () corresponding to the fan. The air guiding element comprises a resisting panel () and a guiding panel () comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end () and a connecting end () connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.

Electronic apparatus with air guiding element

A mounting apparatus for mounting a heat sink on a board, includes a first locking hole defined in the heat sink, a second locking hole defined in the board, and a locking member. The locking member includes a base and a rod. The base defines a hole. A bottom of the base forms a pair of separated elastic claws around the hole. The elastic claws are inserted through the first and second locking holes. The rod includes an expanded portion. The rod slides in the hole of the base with the expanded portion located inbetween the claws to expand the claws outwards to be larger than the second locking hole to lock the locking member on the board and to mount the heat sink on the board.

Mounting apparatus for heat sink

A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.

Circuit board with improved ground plane

In one preferred embodiment, an objective lens actuator includes a base, a suspension apparatus mounted on the base, a holder suspended by the suspension apparatus for holding an objective lens, a voice coil motor (VCM) for driving the holder to vibrate, and a cover. The VCM includes a first yoke, a second yoke and a pair of magnets fixed on the first yoke and the second yoke respectively. The first yoke and the second yoke respectively include a first part and a second part. The cover is made of a material having a magnetic conductivity. The cover connects the first part and the second part of each of the first yoke and the second yoke.

Objective lens actuator

An exemplary optical disc drive apparatus includes a guide shaft configured to movably support a pickup head, and an elastically deformable member. The elastically deformable member includes a main body, and a cantilever slanting up from a middle part of a front edge of the main body. The cantilever is broad at a lower portion thereof and narrow at an upper portion thereof, and the cantilever is for resiliently pressing a corresponding end of the guide shaft. The elastically deformable member reduces a stress surface between the cantilever and the guide shaft, and lengthens the life span thereof.

Growing community of inventors

Taipei Hsien, Taiwan

Jeng-Da Wu