Taiwan Semiconductor Manufacturing Comp. Ltd.

Jen Yu Wang

Chih-Hang Tung

Tung-Liang Shao

Chung-Jung Wu

Sheng-Tsung Hsiao

Chen-Hua Douglas Yu

Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

Packaged semiconductor device including liquid-cooled lid and methods of forming the same

A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.

Growing community of inventors

Hsinchu, Taiwan

Jen Yu Wang