Industrial Technology Research Institute

Merry Electronics (suzhou) Co., Ltd.

Jen-Yi Chen

Kai-Hsiang Yen

Po-Hsun Sung

Yu-Jen Fang

Chun-Chieh Wang

Chin-Horng Wang

Chao-Sen Chang

Yung-Shiang Chang

Po-Hsun Song

An air pressure sensing system including a first sensing unit and a second sensing unit is provided. The first sensing unit includes a substrate, a diaphragm, and a supporting member. The substrate has a cavity connected with an exterior environment. The diaphragm is movably and deformably disposed at the substrate and suspended in the cavity. An electrostatic force is provided to the substrate and the diaphragm to move the diaphragm, such that a portion of the base, the supporting member and the diaphragm are contacted with each other and a closed space is formed therebetween in the cavity. The closed space and the exterior environment are divided by the diaphragm, and the diaphragm is deformed due to an air pressure difference between the closed space and the exterior environment. An air pressure sensing method is also provided.

Air pressure sensing system

A method of manufacturing a capacitive microphone comprises providing a substrate having at least one cavity. The method further comprises forming a backplate on the substrate, wherein the backplate has a plurality of holes, and forming a diaphragm on the backplate, wherein there are a first distance and a second distance between the diaphragm and the backplate. The method still further comprises forming an air gap between the backplate and the diaphragm through the first distance, and fastening the diaphragm to the backplate through the second distance.

Methods for making capacitive microphone

An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer.

Acoustic transducer and microphone using the same

An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transuding and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.

Electro-acoustic sensing device

A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.

Sensor

An MEMS structure and a method of manufacturing the same are provided. The MEMS structure includes a substrate and at least one suspended microstructure located on the substrate. The suspended microstructure includes a plurality of metal layers, at least one dielectric layer, and at least one peripheral metal wall. The dielectric layer is sandwiched by the metal layers, and the peripheral metal wall is parallel to a thickness direction of the suspended microstructure and surrounds an edge of the dielectric layer.

MEMS structure with suspended microstructure that includes dielectric layer sandwiched by plural metal layers and the dielectric layer having an edge surrounded by peripheral metal wall

A capacitive microphone and method for making the same are provided. A backplate with a plurality of holes is formed on a substrate with at least one cavity, and a diaphragm is formed above the backplate. There is an air gap between the backplate and the diaphragm. The air gap and the cavity communicate with each other by each hole. The diaphragm and the backplate are separated by a first distance and a second distance which is smaller than the first distance, such that the difference is formed on the diaphragm. The second distance area is fastened through surface stiction produced by mist or other fluids.

Capacitive microphone and method for making the same

A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber.

Growing community of inventors

Hsinchu County, Taiwan

Jen-Yi Chen