Knowles Electronics, Inc.

Jen Nan Feng

Timothy K Wickstrom

William J Ballad

Ying-Tzu Chan

Mei-Yu Lin

An acoustic system includes a conduit, a microphone coupled to an end of the conduit, and a rigid moisture resistant barrier coupled to another end of the conduit to prevent moisture from traversing the length of the conduit towards the receiver. The moisture resistant barrier dampens an audio signal traversing the conduit. The moisture resistant barrier has a submersion rating at least equal to a 7 Ingress Protection rating.

Earphone assembly with moisture resistance

An acoustic system includes a receiver (or microphone), a tube, or a moisture resistant screen. The receiver is capable of outputting an audio signal, while the microphone receives an audio signal. The tube is in connection with the receiver (or microphone) and the audio signal travels along a length of the tube. The moisture resistant screen is fitted at an end of the tube. The moisture resistant screen prevents moisture from passing along the tube toward the receiver, and causes an amount of damping to the audio signal. The moisture resistant screen is configured to have a submersion rating greater than or equal to 7 IP.

An acoustic system includes a receiver or microphone, a tube, a barrier, and an equalization device. The receiver is capable of outputting an audio signal. The tube is in connection with the receiver and the audio signal travels along a length of the tube. The barrier is fitted along the tube and the barrier prevents moisture from passing along the tube toward the receiver. The barrier causes an amount of damping to the audio signal. The equalization device is in connection with the receiver and the equalization device counteracts the damping by the barrier. The barrier is configured to have a submersion rating greater than or equal to 7 IP.

A microphone () and method of manufacture thereof is disclosed. The microphone () includes a housing (), a diaphragm assembly (), a spacer (), a backplate assembly (), a body assembly (), and a printed circuit board () disposed within the housing (). The diaphragm assembly () and the backplate assembly () constitute a variable capacitor responsive to sound pressure level changes coupled through an acoustic port (). The base capacitance is inversely proportional to the thickness of the spacer (). The backplate assembly () is disk shaped with protrusions and coupled to the body assembly () such that an acoustic passage () is formed between an outer edge of the backplate assembly () and an inner periphery of the hollow body assembly (). The body assembly () comprises conductive mount () for electrically coupling the backplate assembly () to a first surface () of a circuit board (). A second surface () of the circuit board () is then held in contact with the connecting surface () of the housing () by mechanical fastening such as crimping, soldering, welding or adhesive bonding.

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Zhongli, Taiwan

Jen Nan Feng