Taiwan Semiconductor Manufacturing Comp. Ltd.

Epistar Corporation

National Yang Ming Chiao Tung University

Jen-Li Hu

Ming-Fa Chen

Chao-Wen Shih

Tzuan-Horng Liu

Tzu-Chieh Hsu

YewChung Sermon Wu

Tai-Min Chang

Yu Chia Chiu

Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel to top surfaces of the first die and the second die, and the spiral pattern includes at least a turn.

Package and method of fabricating the same

Provided is packages and methods of fabricating a package and. The method includes bonding a first device die with a second device die. The second device die is over the first device die. A bonding structure is formed in a combined structure including the first and the second device dies. A component is formed in the bonding structure. The component includes a passive device or a transmission line. The method further includes forming a first and a second electrical connectors electrically coupling to a first end and a second end of the component.

A light-emitting device comprises a light-emitting structure capable of emitting a light; an electrode formed on a side of the light-emitting structure; a transparent structure formed on a second side of the light-emitting structure, wherein the transparent structure is aligned to a region of the electrode, and comprises a first transparent layer and a second transparent layer around the first transparent layer; a contact structure formed on the second side of the light-emitting structure; and a reflective layer covering the transparent structure and the contact structure.

Light-emitting device and manufacturing method thereof

The present invention related to a method for manufacturing a thermal dissipation substrate and a thermal dissipation substrate. The method includes steps of: (a) providing a substrate body having a surface; (b) forming a plurality of concave regions on the surface; and (c) filling the plurality of concave regions with a plurality of diamond materials. The thermal dissipation substrate includes: a substrate having a surface at a first horizontal; a plurality of regions formed on the surface at a second horizontal; and a plurality of diamond materials having a relatively high thermal coefficient and disposed on the plurality of regions.

Growing community of inventors

Hsinchu, Taiwan

Jen-Li Hu