Industrial Technology Research Institute

Jen-Dong Hwang

Yuan-Chang Fann

Cheng-Chou Wong

Chun-Mu Chen

Yi-Yie Yan

Chih-Chao Yang

Chih-Tsung Tu

Chen-Jow Wong

Min-Yu Yen

Jiann-Jong Su

The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.

Metal thermal interface material and thermal module and packaged microelectronic component containing the material

The invention provides an electrically conductive composite having high conductivity, hermeticity, high mechanical strength, low surface roughness, lightweight, and thin profile. The composite comprises a rubber modified with vinyl ester resin. After curing in mold, the composite may serve as a bipolar plate in a fuel cell. For example, the bipolar plate is combined with a membrane electrode assembly (MEA) to form a proton exchange membrane fuel cell (PEMFC).

Electrically conductive composite

A melting temperature adjustable metal thermal interface material (TIM) is provided. The metal TIM includes In, Bi, Sn, and Ga. A content of Ga ranges from 0.01 wt % to 3 wt %. The metal TIM has an initial melting temperature lower than 60&#xb0; C. and has no element hazardous to the environment.

Melting temperature adjustable metal thermal interface materials and application thereof

A heat dissipation device with an optimal fin arrangement for cooling a CPU. The optimal angle, height, width, and shape of the fins provide superior heat dissipation. The heat dissipation device can be combined with a fan device to form a heat dissipating unit.

Growing community of inventors

Hsinchu, Taiwan

Jen-Dong Hwang