Arizona State University

Medtronic, Inc.

Jemmy Sutanto

Jitendran Muthuswamy

Andrew J Ries

Mark E Henschel

Lea A Nygren

Songhua Shi

Lea Ann Nygren

Various embodiments of an electronics module and an implantable medical device that includes such module are disclosed. The module includes a feedthrough header assembly having a conductive header that includes a conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the header; and a feedthrough pin disposed within a via that extends through the header. The module further includes an electronic layer having a substrate and an electronic component disposed on or within the substrate. The electronic component is electrically connected to the contact of the conductive header such that the electronic component is electrically connected to the header. A major surface of the substrate of the electronic layer faces the conductive inner surface of the header without any intervening nonconductive layers disposed between the major surface of the substrate and the conductive inner surface of the header.

Feedthrough header assembly and device including same

Interconnect and/or reflow methods of the present disclosure achieve high aspect ratio interconnects, for example interconnects having an aspect ratio as high as 4, in addition to wider interconnect height tolerances among interconnects (for example, interconnects having a height variability of up to about 30%) while still achieving reliable electrical connections. Moreover, flip-chip interconnects configured in accordance with principles of the present disclosure can provide improved z-axis spacing between die-to-die and/or die-to-substrate flip chip stacks, for example z-axis spacing as large as 600 &#x3bc;m. In this manner, additional spacing can be achieved for MEMS devices and/or similar components that are extendable and/or deformable out of the die plane.

Systems and methods for high aspect ratio flip-chip interconnects

Systems and methods of the present disclosure provide for three-dimensional stacks of microelectromechanical (MEMS) systems, such as sensors. The stacks may be encapsulated and sealed, and can be positioned within biological tissue, for example to monitor biological signals within the volume of the sensor, provide stimulating signals to a brain, and so forth.

Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems

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Scottsdale, AZ, United States of America

Jemmy Sutanto