International Business Machines Corporation

Jei-Wei Chang

Lubomyr Taras Romankiw

Panayotis Constantinou Andricacos

Bojan Petek

Wilma Jean Horkans

Judith D Olsen

Chin-Jong Chan

Certain alloys of CoFeCu are provided in film and laminate form which have a unique combination of electromagnetic properties which enable them to be used as magnetic thin films in magnetic recording heads, shields and flux guides. The films and laminates thereof are electrodeposited from a plating bath in a DC or pulsed current electrodeposition process.

High magnetic moment materials and process for fabrication of thin film

A metallurgical joint structure between two workpieces to be joined by soldering or brazing includes a stress release layer of a low yield point metal, preferably silver, gold, copper, palladium or platinum. The joint structure also includes a juxtaposed barrier layer to prevent the diffusion of a solder element, such as tin, to the stress release layer. Preferred barrier layers are chromium, titanium-tungsten and tantalum. Preferably, the joint includes one or more stress relief layer and associated barrier layer combinations in the joint structure for improved joint reliability.

Metallurgical joint including a stress release layer

A magnetic thin film structure comprising a first layer of magnetic material having a low anisotropy H.sub.k magnetically coupled to a second layer magnetic material having a high anisotropy H.sub.k and a low coercivity. The laminate provides a dual anisotropy behavior such that the laminate exhibits a high initial permeability at relatively small applied fields during the read operation and a high anisotropy at high applied fields during the write operation. The laminate of the present invention reduces inductive head domain instability produced by the write operation while maintaining high reproducing sensitivity during the read operation. Use of the higher H.sub.k material also reduces the sensitivity of the head performance to variation in process-induced stresses.

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Tuckahoe, NY, United States of America

Jei-Wei Chang