Sandia Corporation

Memx, Inc.

Becton Dickinson and Company Limited

Ht Microanalytical, Inc.

National Technology & Engineering Solutions of Sandia, LLC

Government of the United States of America, As Represented by the Secretary of Commerce

Other

Xerox Corporation

The United States of America As Represented by the United States

Jeffry Joseph Sniegowski

Paul Jackson McWhorter

M Steven Rodgers

Samuel Lee Miller

Murray Steven Rodgers

Stephen M Barnes

Stephen Montague

Todd Richard Christenson

James G Fleming

Richard A Allen

Michael W Cresswell

Randy J Shul

James H Smith

Loren W Linholm

Scott D Habermehl

Seethambal S Mani

Dale L Hetherington

Thomas W Krygowski

R N Ghoshtagore

Paul Charles Galambos

George J Roller

Paul J Resnick

Arthur M Gooray

Kurt O Wessendorf

Ernest J Garcia

Michael Gaitan

William A Zortman

Kevin R Zavadil

Frank J Peter

Richard C Givler

Dale R Koehler

James E Stevens

Christopher Alan Apblett

Carol Fleming, Legal Representative

Robert D Nasby

William B Penzes

Karl Douglas Greth

Kurt W Larson

Robert S Blewer

Anthony J Farino

Gregory Paul Salazar

D Russell Humphreys

Craig Y Nakakura

John Mudrick

Michael J Rye

Caitlin Rochford Friedman

Hugh M Bivens

Joseph M Crowley, Jr

Steven R Volk

The present invention relates to methods of delayering a semiconductor integrated circuit die or wafer. In at least one aspect, the method includes exposing a die or wafer to plasma of an etching gas and detecting exposure of one or more metal layers within the die. In one aspect of the invention, the plasma of the etching gas is non-selective and removes all materials in a layer at about the same rate. In another aspect of the invention, two different plasmas of corresponding etching gases are employed with each plasma of the etching gas being selective, thus necessitating the sequential use of both plasmas of corresponding etching gases to remove all materials in a layer.

Plasma-based method for delayering of circuits

Various technologies for simultaneously making a plurality of modifications to a previously manufactured semiconductor are described herein. A mask layer is applied to a surface of the previously manufactured semiconductor device. A pattern is formed in the mask layer, where the pattern is aligned with a plurality of features of the semiconductor device that are desirably modified. Layers of the semiconductor device are etched based on the pattern to create a plurality of vias that each extend through one or more layers of the semiconductor device to a respective feature of the device. A conducting material is deposited into the vias to form a plurality of conducting plugs. Conducting material may be further deposited on the surface of the semiconductor device to connect plugs to one another and/or connect plugs to surface features of the device, thereby forming a plurality of new connections between features of the semiconductor device.

Method for simultaneous modification of multiple semiconductor device features

An integrating impact switch that can discriminate between accelerations due to different stimuli is provided. Embodiments of the present invention actuate only in response to an acceleration whose magnitude is equal to or greater than an acceleration threshold for a predetermined continuous period of time. Embodiments of the present invention comprise an impact switch having a throw that is operatively coupled with a viscous damper that dampens motion of the throw. As a result, a stimulus that imparts an acceleration that meets or exceeds an acceleration threshold for a time period less than a predetermined time-period threshold does not actuate the switch. A stimulus that imparts an acceleration whose magnitude is equal to or greater than the acceleration threshold for a time period equal to the time-period threshold, however, does actuate the switch.

Integrating impact switch

A cutting blade is disclosed fabricated of micromachined silicon. The cutting blade utilizes a monocrystalline silicon substrate having a {211} crystalline orientation to form one or more cutting edges that are defined by the intersection of {211} crystalline planes of silicon with {111} crystalline planes of silicon. This results in a cutting blade which has a shallow cutting-edge angle &#x3b8; of 19.5&#xb0;. The micromachined cutting blade can be formed using an anisotropic wet etching process which substantially terminates etching upon reaching the {111} crystalline planes of silicon. This allows multiple blades to be batch fabricated on a common substrate and separated for packaging and use. The micromachined cutting blade, which can be mounted to a handle in tension and optionally coated for increased wear resistance and biocompatibility, has multiple applications including eye surgery (LASIK procedure).

Micromachined cutting blade formed from {211}-oriented silicon

One embodiment of a MEMS flow module () includes a first plate () and a second plate () that are separated by a first link (). A plurality of concentrically disposed, annular flow-restricting walls () extend from the first plate (), and each is separated from the second plate () by a flow-restricting gap (). When the MEMS flow module () is exposed to a differential pressure and in one configuration, a perimeter () of the first plate () flexes away from the second plate () (and at least generally about where the first link () interfaces with the first plate ()) to increase the size of one or more of the flow-restricting gaps (), to in turn accommodate an increased flow or flow rate through the MEMS flow module ().

Glaucoma implant having MEMS flow module with flexing diaphragm for pressure regulation

Various MEMS filter elements or modules are disclosed, and which may be used in a glaucoma implant (). One such MEMS filter module () includes a first film () and a second film () that are spaced and interconnected by a plurality of supports (). A plurality of first flow ports () extend through the first film (), and a plurality of second flow ports () extend through the second film (). A plurality of annular filter walls () extend from the second film () toward the first film (), and are separated therefrom by a filter trap gap ().

Glaucoma implant having MEMS filter module

Various embodiments of MEMS flow modules that may be disposed in a flow path () of a shunt () are disclosed, where the shunt () may be used to control a flow out of an anterior chamber () of an eye (). One such MEMS flow module () has a tuning element () and a lower plate (). A plurality of springs or spring-like structures () interconnect the tuning element () with the lower plate () in a manner that allows the tuning element () to move either toward or away from the lower plate (), depending upon the pressure being exerted on the tuning element () by a flow through a lower flow port () on the lower plate (). The tuning element () is disposed over this lower flow port () to induce a flow through the MEMS flow module () along a non-linear (geometrically) flow path.

Implant having MEMS flow module with movable, flow-controlling baffle

Various MEMS filter elements or modules are disclosed. One such MEMS filter module () includes a first film () and a second film () that are spaced and interconnected by a plurality of supports (). A plurality of first flow ports () extend through the first film (), and a plurality of second flow ports () extend through the second film (). A plurality of annular filter walls () extend from the second film () toward the first film (), and are separated therefrom by a filter trap gap (). A filter trap chamber () is disposed on each side of each filter trap gap (). Therefore, fluid will flow into one filter trap chamber (), through a filter trap gap (), and into another filter trap chamber (), whether the flow is introduced into the filter module () through the first flow ports () or the second flow ports ().

MEMS filter module

A cutting blade () having a cutting edge () defined by an intersection of a first cutting edge surface () and a second cutting edge surface () is disclosed. The angle between the first cutting edge surface () and the second cutting edge surface () defines a blade angle (&#x3b8;). The blade () may be fabricated from a wafer () by an anisotropic etch. An upper surface () of the wafer () is defined by a first set of 3 Miller indices, where at least one individual Miller index of this first set has an absolute value greater than 3. A top surface () of the blade () is defined by part of the upper surface () of the wafer (). The anisotropic etch proceeds until reaching a particular crystallographic plane to define the first cutting edge surface (). Having the top surface () of the blade () defined by the noted set of 3 Miller indices increases the potential that a blade angle (&#x3b8;) of a desired magnitude may be realized.

Microkeratome blade with arbitrary blade angle

A microelectromechanical system is disclosed that constrains the direction of a force acting on a first load, where the force originates from the interaction of the first load and a second load. In particular, the direction of a force acting on the first load is caused to be substantially parallel with a motion of the first load. This force direction constraint is achieved by a force isolator microstructure that contains no rubbing or contacting surfaces. Various embodiments of structures/methods to achieve this force direction constraint using a force isolator microstructure are disclosed.

Microelectromechanical system with non-collinear force compensation

The present invention generally relates to a die perimeter region of a die having a microelectromechanical assembly fabricated thereon. This die perimeter region may be configured to facilitate electrically interconnecting adjacent die on a wafer. Moreover, this die perimeter region may be configured to facilitate separating the die from a wafer.

Method for making a multi-die chip

The present invention provides a MEM system () having a platform () that is both elevatable from the substrate () on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (). In one embodiment, the MEM system () includes the platform (), a pair of A-frame structures (), and two pairs of actuators () formed on the substrate (). Ends (A) of rigid members () extending from apexes (A) of the A-frame structures () are attached to the platform () by compliant members (A,B). The platform () is also attached to the substrate () by a compliant member (C). The A-frame structures () are separately pivotable about bases (B) thereof. Each pair of actuators () is coupled through a yoke () and displacement multiplier () to one of the A-frame structures () and is separately operable to effect pivoting of the A-frame structures () with respect to the substrate () by equal or unequal angular amounts. Upon pivoting, the A-frame structures () act as lever arms to both lift the platform () and tilt the platform () with respect to the substrate () with at least one degree of freedom. Since the platform () lifts up from the surface of the substrate (), it may be tilted at large angles with respect to the substrate ().

Microelectromechnical system for tilting a platform

The present invention provides a MEM system ( ) having a platform ( ) that is both elevatable from the substrate ( ) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate ( ). In one embodiment, the MEM system ( ) includes the platform ( ), a pair of A-frame structures ( ), and two pairs of actuators ( ) formed on the substrate ( ). Ends ( A) of rigid members ( ) extending from apexes ( A) of the A-frame structures ( ) are attached to the platform ( ) by compliant members ( A, B). The platform ( ) is also attached to the substrate ( ) by a compliant member ( C). The A-frame structures ( ) are separately pivotable about bases ( B) thereof. Each pair of actuators ( ) is coupled through a yoke ( ) and displacement multiplier ( ) to one of the A-frame structures ( ) and is separately operable to effect pivoting of the A-frame structures ( ) with respect to the substrate ( ) by equal or unequal angular amounts. Upon pivoting, the A-frame structures ( ) act as lever arms to both lift the platform ( ) and tilt the platform ( ) with respect to the substrate ( ) with at least one degree of freedom. Since the platform ( ) lifts up from the surface of the substrate ( ), it may be tilted at large angles with respect to the substrate ( ).

Microelectromechanical system for tilting a platform

Growing community of inventors

Edgewood, NM, United States of America

Jeffry Joseph Sniegowski