Texas Instruments Corporation

Jeffrey W Marsh

David L Hamilton

R Tracy White

Joshua Malone

Edward Carl Fisher

William Kevin Dennis

Seth Andrian Miller

Jack C Smith

Lea Adams

A wire bonder () with a rigid pedestal () having resilient inserts (). A package () placed on the pedestal () contains an electrical device (). The bond pads on the electrical device () are electrically connected to bond pads on the package () by a series of bond wires () through use of a well know bonding process. A vacuum source holds the package () against the pedestal () deforming the resilient strips () located in the rigid member () of the pedestal and ensuring good contact between the ground pads of the package () and conductive resilient members (). The resilient members () are conductive and electrically connect the package grounds to a system ground ().

Compliant wirebond pedestal

The present invention provides, in one aspect, a method of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate. The method further includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes lubricating/passivating the MEMS device through the opening. In addition, a MEMS assembly constructed according to a process of the present invention is also disclosed.

Method for lubricating MEMS components

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Murphy, TX, United States of America

Jeffrey W Marsh