Pacesetter, Inc.

Jeffrey Urbanski

John R Gonzalez

Tommy Cushing

Jodi Townsley Dubuclet

Theodore Alfonso

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

Implantable thin film devices

An implantable medical lead may include a lead body, a substrate, and an elastic deflection component. The lead body includes a proximal end configured to couple to an implantable pulse generator, a distal end opposite the proximal end, and an electrical conductor extending through the lead body. The substrate is at the distal end and supports an array of electrodes. The elastic deflection component physically and electrically connects the electrical conductor and an electrode of the array of electrodes. The elastic deflection component is configured to compensate for at least one of tension forces or compression forces transferred from the electrical conductor to the electrode of the array of electrodes.

Paddle lead with elastic deflection coupling between feed wire and paddle

Implementations described and claimed herein provide implantable electronic devices having a thin film feedthrough and methods of manufacturing the same. In one implementation, an implantable electronic device includes a housing enclosing one or more internal electronic components within a hermetic environment. A feedthrough port is defined in a wall of the housing. A thin film feedthrough has a feedthrough body extending through the feedthrough port. The feedthrough body provides one or more electrical pathways between external contacts and internal contacts. The external contacts are disposed outside the hermetic environment, and the internal contacts are electrically connected to the one or more internal electronic components at an internal connection junction. A hermetic junction is disposed in the feedthrough port isolating the thin film feedthrough from the housing.

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Frisco, TX, United States of America

Jeffrey Urbanski