Apple Inc.

Jeffrey Thomas Hill

Alfredo Bismuto

Michael J Bishop

Alexander Goldis

Kwan-Yu Lai

Donna Rene Hill

Jeremy D Witmer

Alex Goldis

Tomas Sarmiento

Junkyo Suh

Yigit O Yilmaz

A photonics package may include a substrate, a hanging connector, and a fast-axis collimator ('FAC'). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.

Fast-axis collimator with hanging connector

A photonic integrated circuit including multiple elements formed by different processes onto separate chips can be manufactured by defining, via photolithography processes for example, complementary geometries onto each separate chip. Thereafter, the complementary geometries can be aligned and engaged, thereby optically and mechanically intercoupling the several chips to define a single photonic integrated circuit.

Chip-to-chip optical coupling for photonic integrated circuits

Configurations for an edge-generated vertical emission laser that vertically emits light and fabrication methods of the edge-generated vertical emission laser are disclosed. The edge-generated vertical emission laser may include a distributed feedback (DFB) laser structure, a grating coupler, and contact layers. Light may propagate through the DFB laser structure, approximately parallel to the top surface of the edge-generated vertical emission laser and be directed by the grating coupler toward the top surface of the edge-generated vertical emission laser. The light may vertically emit from the edge-generated vertical emission laser approximately perpendicular to the top surface of the edge-generated vertical emission laser. Additionally, the contact layers may be n-metal and p-metal, which may be located on the same side of the edge-generated vertical emission laser. These features of the edge-generated vertical emission laser may facilitate ease of testing and increased options for packaging.

Integrated edge-generated vertical emission laser

Portable urine collection station

Configurations for a photonics assembly and the operation thereof are disclosed. The photonics assembly may include multiple photonics dies which may be arranged in an offset vertical stack. The photonics dies may emit light, and in some examples, an optical element may be a detector for monitoring properties such as the wavelength of the light. The photonics dies may be arranged in a stack as a package and the packages may be stacked or arranged side by side or both for space savings. The PIC may include combining and/or collimating optics to receive light from the photonics dies, a mirror to redirect the light, and an aperture structure. The aperture structure may include a region which is at least partially transparent such that light transmits through the transparent region of the aperture structure. The aperture structure may include an at least partially opaque region which may be used for directing and/or controlling the light launch position.

Photonics assembly with a photonics die stack

Growing community of inventors

Los Altos, CA, United States of America

Jeffrey Thomas Hill