Imperial Chemical Industries Limited

Cytec Technology Corporation

Croda International, Inc.

Cytec Industries Inc.

Fiberite Inc.

Ici Composites Inc.

Cytec Technology Crop.

Uniqema B.v.

Jeffrey Thomas Carter

Patrick Terence McGrail

Stephen Derek Jenkins

Robin Kelvin Maskell

Eric Appelman

Martin T Choate

Mark S Sefton

Scott D Lucas

Peter R Ciriscioli

Renee-van Schijndel

Carmelo LoFaro

Carmelo Lo Faro

Eric Appleman

Renee Josie Gide Van Schijndel

Robin K Maskell

Renee Van Schijndel

Patrick Terence Mcgrail

Renee-Van Schijndel

An adhesive containing polyisocyanate and a polyol containing at least one dimer fatty acid and/or dimer fatty diol. The adhesive is particularly suitable for use on wood.

Adhesive derived from dimeric fatty acid or dimeric fatty diol

A resin binder composition for the production of a fiber preform comprising an amount of at least one polyarylether thermoplast resin component and an amount of at least one thermoset resin component in weight ratio 80/20-10/90, in substantial absence of a catalyst which is active at the prevailing preform production temperature, wherein the polyarylether thermoplast has number average molecular weight (Mn) in the range 2,000-20,000, and comprises ether linked phenyl units and ether linked arylsulphone units and reactive end groups, method for producing a fiber preform using the thermally stable binder resin composition, a perform obtained with use of the method and composition, a method for injecting or infusing the preform with curable matrix resin, the curable injected or infused preform resin, a method for curing thereof and a cured composite obtained with the method.

Binder of reactive polyarylethersulphone and epoxy resin

A composition capable of phase separation contains an epoxy resin and an impact modifier formed from at least one dimer fatty acid and/or dimer fatty diol. The composition is suitable for use as an adhesive, particularly in microelectronics.

Epoxy resin composition

A flexible polymer element for a curable composition wherein the flexible polymer element is in solid phase and adapted to undergo at least partial phase transition to fluid phase on contact with a component of the curable composition in which it is soluble at a temperature which is less than the temperature for substantial onset of gelling and/or curing of the curable composition; a method for the preparation thereof, a support structure or carrier for a curable composition comprising the at least one flexible polymer element together with reinforcing fibers, configurations of support structures and carriers, methods for preparation thereof, a curable composition comprising the at least one flexible polymer element or the support structure or carrier and a curable resin matrix, a kit of parts comprising the components thereof and a method for selection thereof, a method for preparation and curing thereof, and a cured composite or resin body obtained thereby, and known and novel uses thereof.

Flexible polymer element as toughening agent in prepregs

A polyesteramide copolymer having a glass transition temperature (Tg) of less than or equal to 0&#xb0; C., contains at least one hard segment containing at least one amide bond, and at least one soft segment containing at least one ester bond. The soft segment is formed from at least one dimer fatty acid and/or dimer fatty diol and/or equivalent thereof. The copolymer is particularly suitable for use as a hot melt adhesive on low energy surfaces.

Polyesteramide copolymer

A polymer composition comprising chains of at least one aromatic polymer or a mixture thereof together with at least one chain linking component wherein the at least one aromatic polymer comprises polymer chains of number average molecular weight (Mn) in a first range and characterised by a polymer flow temperature, and having at least one reactive end group, and wherein the at least one chain linking component comprises at least two linking sites, characterised in that a plurality of the polymer chain end groups are adapted to react with the linking sites at chain linking temperature in excess of the polymer flow temperature to form linked polymer chains of number average molecular weight (Mn) in a second range which is in excess of the first range, substantially thermoplastic in nature; process for the preparation thereof; prepreg, composite or shaped product obtained therewith and the use thereof.

Compositions adapted for chain linking

Curable composition comprising at least one polyaromatic having reactive end groups, at least one thermoset resin, and a reactive catalyst, wherein the reactive end groups are adapted to react with the catalyst, characterized in that the catalyst comprises a Lewis acid having amine functionality, suitably the catalyst is of the formula: LXn.R where LXn is a Lewis acid and R is a amine; process for the preparation thereof; method for curing thereof; cured products and prepreg; and method for cure cycle design.

Variable temperature curable composition

A block copolyester comprises a hard segment and a soft segment, wherein the melting point of the copolyester is greater than or equal to 200&deg; C., and the glass transition temperature of the copolyester is less than or equal to &minus;40&deg; C. The hard segment is preferably polyethylene terephthalate, polybutylene terephthalate, or polyethylene naphthalate. The soft segment is preferably formed from at least one dimer fatty acid and/or dimer fatty diol and/or equivalent thereof. The copolyester is especially suitable for use in automotive parts, particularly where thermal stability is required.

Block copolyester

Process for the preparation of a polymer composition comprising at least one aromatic or a mixture thereof, the process comprising: i) obtaining a reaction mixture comprising polymer precursors in a first fluid boiling in excess of 100 C.; ii) subjecting the reaction mixture to a first elevated temperature in excess of 100 C. to generate the alkali metal salts of polymer precursors and the polymer reaction products thereof; and iii) subjecting the reaction product mixture to at least a second temperature and isolating the reaction product in the form of a polymer composition which is substantially insoluble in a second fluid, form the first fluid which is substantially soluble in the second fluid, by contacting with an amount of second fluid; wherein the process is conducted in substantial absence of an effective amount of an azeotrope; novel intermediates thereof, polymer composition obtained thereby; resin formulation thereof; method for manufacture of composites thereof, and uses thereof.

Process for preparing polyarlethers

A curable composition including a thermoset resin a curing agent component, an amount of a thermoplast component having reactive pendant and/or end groups, an organometallic curing catalyst component. The organometallic curing catalyst component is capable of forming cross-links with reactive pendant and/or end groups of the thermoset and thermoplast resins and comprises an organometallic complex compound of the formula I&equals;M(R),, where M is selected from titanium, zirconium, hafnium, cerium, vanadium, niobium, R is selected from mono-, bi- and tri and/or tetra dentate organic ligands and n is four or six.

Curable thermoset resin composition

A shaped article optionally containing a prepreg, or a composite derived from the shaped article with the prepreg, is prepared from a curable composition derived from the reaction in the presence of a catalyst of epoxy resin having at least 0.05% by weight of an epoxy resin oligomer with a solid rubber possessing at least 1% by weight of reactive groups and which is swellable or soluble in the reaction mixture, in a rubber epoxy resin weight ratio between 1:1 to 1:20, wherein said epoxy resin comprises (a) at least one first epoxy resin having an epoxy functionality of greater than three and (b) at least one second epoxy resin having a functionality of greater than one to three.

Curable compositions

At least trifunctional epoxy resin reacted with solid rubber mixed with

Polymer compositions comprising phenol/formaldehyde systems and polyarylsulphones having epoxy pendent or end groups are disclosed together with novel epoxy-ended polyarylsulphones and novel cross-linked epoxy-ended polyarylsulphones. The compositions can be both unreinforced and reinforced with fibres and/or other fillers.

Polymeric compositions and components thereof

A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60.degree. C., flowable under shear and self-adhesive at temperatures in the range 60.degree.-150.degree. C. and hardenable at temperature over 150.degree. C., said composition comprising an uncured or partly cured thermoset resin precursor and, mixed intimately therewith, a polyarylsulphone containing the repeating units (Ph SO.sub.2 Ph).sub.n and Ph.sup.1.sub.a linked through ether and/or thioether, where Ph is paraphenylene, Ph.sup.1 is phenylene, n is 1 to 2 a is 1 to 3 and groups Ph.sup.1 are (when a exceeds 1) linked through a single chemical bond or a divalent group other than SO.sub.2 or alkylene or are fused together. Preferably the polyarylsulphone contains end-groups of formula --D--Y where D is a divalent aromatic hydrocarbon group and Y is a group reactive with the thermoset precursor and has been incipiently reacted with the thermoset precursor.

Growing community of inventors

Cleveland, United Kingdom

Jeffrey Thomas Carter