Altera Corporation

Cypress Semiconductor Corporation

Intel Corporation

Alters Corporation

Jeffrey T Watt

Shuxian Chen

Irfan Rahim

Andy Louie Lee

Yanzhong Xu

Antonio Gallerano

Christopher J Pass

Srinivas Perisetty

Cheng-Hsiung Huang

William Bradley Vest

Yue-Song He

Jun Liu

Albert Ratnakumar

Richard G Smolen

Charles Chu

Rusli Kurniawan

Qi Xiang

Myron Wai Wong

Shankar Sinha

Lin-Shih Liu

Mark Chan

Shih-Lin S Lee

Jeffrey Xiaoqi Tung

Che Ta Hsu

Bruce B Pedersen

David Lewis

Richard G Cliff

Vaughn Betz

Christopher F Lane

Andrew J Walker

John E Turner

Paul Leventis

Chih-Ching Shih

Yow-Juang Bill Liu

Kedar Patel

Lakhbeer Singh Sidhu

Chun Lee Ler

Dale Ibbotson

Timothy Vanderhoek

Wilson Wong

Bonnie I Wang

Weiqi Ding

Peter John McElheny

Yan Cui

Ping-Chen Liu

Haiming Yu

Yowjuang (Bill) Liu

Cheng H Huang

Roger F Caldwell

Hugh Sung-Ki O

Teng Chow Ooi

Queennie Suan Imm Lim

Wen Wu

Alok Nandini Roy

Mao Du

Christopher Sun Young Chen

Anwen Liu

Mojy Curtis Chian

Integrated circuits with an array of programmable resistive switch elements are provided. A programmable resistive switch element may include two non-volatile resistive memory elements connected in series and two varistors. A first of the two varistors is used to program a top resistive memory element in the resistive switch element, whereas a second of the two varistors is used to program a bottom resistive memory element in the resistive switch element. Row and column drivers implemented using only thin gate oxide transistors are used to program a selected resistive switch in the array without violating a maximum voltage level that satisfies predetermined defects per million (DPM) reliability criteria.

Methods and circuitry for programming non-volatile resistive switches using varistors

Integrated circuits with programmable resistive switch elements are provided. A programmable resistive switch element may include two non-volatile resistive elements connected in series and a programming transistor. The programmable resistive switch elements may be configured in a crossbar array and may be interposed within the user data path. Driver circuits may also be included for selectively turning on or turning off the switches by applying positive and optionally negative voltages.

Integrated circuits with programmable non-volatile resistive switch elements

Integrated circuits with memory elements are provided. A memory element may include non-volatile resistive elements coupled together in a back-to-back configuration or an in-line configuration. Erase, programming, and margining operations may be performed on the resistive elements. Each of the resistive memory elements may receive a positive voltage, a ground voltage, or a negative voltage on either the anode or cathode terminal.

Integrated circuits with complementary non-volatile resistive memory elements

An integrated circuit capable of monitoring aging effects on an integrated circuit device is disclosed. The integrated circuit includes a control circuit that obtains a clock signal at different frequencies. A sense circuit may receive the clock signal. First and second control signals may be asserted on the integrated circuit with the control circuit. The first control signal may activate a stress mode, and the second control signal may activate a measurement mode. During stress mode, the sense circuit may receive the clock signal. Any changes in predetermined electrical parameters of one or more transistors in the sense circuit may be monitored and measured during the measurement mode. Aging compensation may be performed when aging effect is detected on the sense circuit.

Methods and apparatus for monitoring aging effects on an integrated circuit

An integrated circuit includes a buffer circuit, a receiving circuit, and a programmable repeater circuit. The programmable repeater circuit includes a routing input and an enable input. The programmable repeater circuit buffers an input signal received at the routing input from the buffer circuit through a first conductor to generate an output signal that is provided to an input of the receiving circuit through a second conductor only in response to an enable signal at the enable input enabling the programmable repeater circuit.

Programmable repeater circuits and methods

Hardened programmable logic devices are provided with programmable circuitry. The programmable circuitry may be hardwired to implement a custom logic circuit. Generic fabrication masks may be used to form the programmable circuitry and may be used in manufacturing a product family of hardened programmable logic devices, each of which may implement a different custom logic circuit. Custom fabrication masks may be used to hardwire the programmable circuitry to implement a specific custom logic circuit. The programmable circuitry may be hardwired in such a way that signal timing characteristics of a hardened programmable logic device that implements a custom logic circuit may match the signal timing characteristics of a programmable logic device that implements the same custom logic circuit using configuration data.

Hardened programmable devices

An integrated circuit package may include a substrate and an interposer. The interposer is disposed over the substrate. The interposer may include embedded switching elements that may be used to receive different power supply signals. An integrated circuit with multiple logic blocks is disposed over the substrate. The switching elements embedded in the interposer may be used to select a power supply signal from the power supply signals and may be used to provide at least one circuit block in the integrated circuit with a selected power supply signal.

Integrated circuit package with active interposer

Apparatus for integrated capacitors and associated methods are disclosed. In one embodiment, an integrated capacitor includes a first plurality of metal members that are fabricated using a first plurality of metal layers, and are oriented in a first orientation. The integrated capacitor also includes a second plurality of metal members that are fabricated using a second plurality of metal layers. The second plurality of metal members are oriented transverse to the first orientation. The integrated capacitor further includes a third plurality of metal members, which are fabricated using a third plurality of metal layers, and are oriented in the first orientation.

Apparatus and associated methods for capacitors with improved density and matching

Illustratively, a finFET comprises at least one fin, and typically several fins, with a trapping region in or on a substrate at the base of each fin to trap ions produced by radiation incident on the substrate. In one embodiment, the trapping region is an implanted region having a conductivity type opposite that of the substrate. In another, the trapping region is a defect region. In another, the trapping region is an epitaxial region grown on the substrate. The finFET is formed by forming the fin or fins and then forming the trapping region at the base of the fin. Illustratively, the trapping region is formed by implanting in the substrate ions having a conductivity type opposite that of the substrate or by creating defects in the substrate or by epitaxially growing a region or regions having an opposite conductivity type to that of the substrate.

FinFET with improved SEU performance

Integrated circuits with memory elements are provided. An integrated circuit may include logic circuitry formed in a first portion having complementary metal-oxide-semiconductor (CMOS) devices and may include at least a portion of the memory elements and associated memory circuitry formed in a second portion having nano-electromechanical (NEM) relay devices. The NEM and CMOS devices may be interconnected through vias in a dielectric stack. Devices in the first and second portions may receive respective power supply voltages. In one suitable arrangement, the memory elements may include two relay switches that provide nonvolatile storage characteristics and soft error upset (SEU) immunity. In another suitable arrangement, the memory elements may include first and second cross-coupled inverting circuits. The first inverting circuit may include relay switches, whereas the second inverting circuit includes only CMOS transistors. Memory elements configured in this way may be used to provide volatile storage characteristics and SEU immunity.

Memory elements with relay devices

Asymmetric transistors may be formed by creating pocket implants on one source-drain terminal of a transistor and not the other. Asymmetric transistors may also be formed using dual-gate structures having first and second gate conductors of different work functions. Stacked transistors may be formed by stacking two transistors of the same channel type in series. One of the source-drain terminals of each of the two transistors is connected to a common node. The gates of the two transistors are also connected together. The two transistors may have different threshold voltages. The threshold voltage of the transistor that is located higher in the stacked transistor may be provided with a lower threshold voltage than the other transistor in the stacked transistor. Stacked transistors may be used to reduce leakage currents in circuits such as memory cells. Asymmetric transistors may also be used in memory cells to reduce leakage.

Integrated circuits with asymmetric and stacked transistors

An integrated circuit system, and a method of manufacture thereof, includes: an integrated circuit substrate; and a discretized tunable precision resistor having a total resistance including: a resistor body over the integrated circuit substrate, interconnects directly on the resistor body, metal taps directly on the interconnects and at opposing sides of the resistor body, and conductive metal strips over the interconnects, wherein the total resistance is a function of an active resistor length of the resistor body between a pair of the metal taps in contact with two of the conductive metal strips.

Integrated circuit system with tunable resistor and method of manufacture thereof

Memory elements are provided that exhibit immunity to soft error upset events when subjected to radiation strikes such as high-energy atomic particle strikes. Each memory element may each have four inverter-like transistor pairs that form a bistable element, a pair of address transistors, and a pair of relatively weak transistors connected between two of the inverters that create a common output node which is resistant to rapid changes to its state. The transistors may be connected in a pattern that forms a bistable memory element that is resistant to soft error upset events due to radiation strikes. Data may be loaded into and read out of the memory element using the address transistor pair.

Memory elements with soft error upset immunity

An integrated circuit is disclosed. The integrated circuit includes an input-output (IO) buffer circuit. The IO buffer circuit further includes first and second transistors coupled in series. The first transistor receives an input signal and the second transistor receives a pulsed voltage signal. Furthermore, a method to operate the IO buffer circuit is also disclosed.

Input-output buffer circuit with a gate bias generator

Growing community of inventors

Palo Alto, CA, United States of America

Jeffrey T Watt