International Business Machines Corporation

Jeffrey T Gotro

Konstantinos I Papathomas

Alfred Viehbeck

Jeffrey Curtis Hedrick

Niranjan Mohanlal Patel

Jane M Shaw

Ali Afzali-ardakani

William Joseph

A composition comprising a thermoset resin which may or may not contain fluorine, bromine or both and containing at least one bromine-containing homo- or multicomponent thermoplastic polymer modifier optionally containing a different halogen which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

Homo-, co-  or multicomponent thermoplastic polymer dispersed in a thermoset resin

The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.

Homo-, co- or multicomponent thermoplastic polymer dispersed in a

A composition having enhanced fracture resistance comprising a heat curable reaction product of a fluorine-containing thermoset material and a fluorine-containing homopolymer, wherein the cured reaction product comprises the thermoset material having a plurality of discrete phases of said fluorine-containing homopolymer dispersed therein, the homopolymer phases being in the range of micron to submicron size.

A prepreg comprising a reinforcing material impregnated with a curable material. The curable material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structure

Prepreg and cured laminate fabricated from a toughened polycyanurate

A curable material comprising a blend of a fluorine-containing cyanate and a fluorine-containing poly(arylene ether) wherein said cyanate is a monomer having the structure

Modified dicyanate ester resins having enhanced fracture toughness

A laminate comprising a layer of conductive metal and a plurality of layers of a cured prepreg is disclosed. The prepreg comprises a reinforcing material impregnated with a curable material. The curable material is a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structure

Multilayer article comprising a toughened polycyanurate

An electronic circuit package comprising an electrically conductive circuit layer on a polymer, ceramic or multi-layer substrate wherein a curable dielectric material is applied over the electrically conductive circuit layer. The curable dielectric material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structure

Multilayer article having a planarized outer layer comprising a

An electronic circuit package comprising an electrically conductive pattern embedded within a curable material. The curable material comprises a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structure

Structures fabricated from toughened polycyanurate

A curable material comprising a particulate filler and a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structure

Toughened polycyanurate resins containing particulates

A prepreg which is heat curable within a temperature range of between about 200.degree. C. and 325.degree. C. comprising a reinforcing material impregnated with a curable material said curable material comprising a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer wherein said cyanate is a monomer having the structure

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Endwell, NY, United States of America

Jeffrey T Gotro