Google Inc.

Brunswick Corporation

Siemens Industry, Inc.

Jeffrey Scott Spaulding

Jeremy Rice

Huan D Nguyen

Michael Chi Kin Lau

Bill Dailey

Jonathan Beck

Jinal Dalal

Dean Vinson Davis

Eugene L Kesselhuth

Debosmita Das

Winnie Leung

Richard Lidio Blanco

Mark Ramon Imbertson

Evan Fraisse

Kenneth L Gallaher

Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.

Impinging jet manifold for chip cooling near edge jets

A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation.

Thermosiphon systems for electronic devices

A thermosiphon system includes a condenser and an evaporator fluidly coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.

A method of assembling a thermosiphon system includes placing a base of an evaporator and a tube of a condensate line in a brazing fixture such that the base covers an aperture in a bottom of the tube with a bottom surface of the base abutting a precision machined surface of the brazing fixture, and simultaneously brazing the base and the tube while held by the brazing fixture to form a unitary body in a single brazing process, the unitary body including the evaporator and the condensate line.

Manufacturing process for thermosiphon heat exchanger

A computer component mounting assembly includes a carrier to support a hard drive and a data connector. The carrier is configured to slidably receive the hard drive along a first axis. The data connector includes a first connector configured to mate to pins of the hard drive, a second connector configured to mate to a SATA data connector, and a flexible cable connecting the two. The first connector includes an alignment feature to engage a corresponding alignment feature on the hard drive. The first connector is coupled to the carrier and slidable in a plane perpendicular to the first axis, and the first connector is configured such that when carrier receives the hard drive and the alignment feature engages the corresponding alignment feature the first connector moves in the plane perpendicular to the first axis to provide alignment of the first connector to the pins of the hard drive.

Computer component connector

The present disclosure provides a method of safely activating and deactivating hot-swap circuitry powered off of a bus bar. One aspect of the present technology provides a method that includes receiving a bus bar connector. The bus bar connector includes a housing having first and second electrical contacts. The first and second electrical contacts are configured to connect with a bus bar. The bus bar connector also includes a short pin detector attached to the housing. The short pin detector is configured to transmit one or more signals. The method includes engaging the first and second electrical contacts with the bus bar. In response to engaging of the first and second electrical contacts, a first signal can be transmitted indicating that the housing is connected to the bus bar and a hot-swap payload associated with the bus bar connector is activated.

Method to implement a short pin detector on a bus bar

A thermosiphon system includes a condenser and an evaporator fluidically coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.

A printed circuit board (PCB) support system includes a guide attachable to a housing of a computing assembly that includes a motherboard and a daughterboard, the guide including a locking assembly that includes a notch and a surface angled toward the notch and is biased to snap over a portion of a side edge of the daughterboard received into the notch; and a PCB support attachable to a surface of the motherboard, the PCB support including a cleft sized to support a bottom edge of the daughterboard.

Supporting computer boards

The present disclosure provides various bus bar connectors configured to draw power from a bus bar at non-discrete locations. In one aspect, a bus bar connector may include a connector housing having a slot. The slot may be configured to allow the connector housing to grip a bus bar at different locations. First and second electrical contacts may be disposed on opposite sides of the slot. The bus bar connector includes mounting members for securing the connector housing against an enclosure for the bus bar and a spring clip that can be to attach to upper and lower outer surfaces of the connector housing to provide an amount of contact force onto the outer surface of the connector housing. The amount of contact force enables the first and second electrical contacts to securely grip the bus bar.

Pitch agnostic bus-bar with pitch agnostic blind mate connector

The systems and methods described herein include, among other things, a hard disk drive (HDD) retention system that has an HDD carrier assembly into which an HDD is positioned, and which allows an HDD to be inserted and ejected quickly. The carrier assembly includes spring elements, which, upon insertion of the HDD into the carrier assembly, compress, and exert a force on the HDD, retaining it within the assembly, in addition to reducing vibration transmission between the HDD and the carrier assembly.

Hard disk drive retention

A two-phase working fluid, having a liquid phase and a gas phase, is purged of non-condensable gas prior to being used to charge a closed thermal management system, improving the heat transfer performance of the thermal management system. The liquid phase of the two-phase working fluid is exposed to conditions that cause non-condensable gas to separate from the two-phase working fluid. The non-condensable gas is vented, and two-phase working fluid that vaporizes under the conditions is captured.

Growing community of inventors

Sunnyvale, CA, United States of America

Jeffrey Scott Spaulding