Lenovo (Singapore) Pte. Ltd.

Lenovo Global Technology (United States) Inc.

Lenovo (United States) Inc.

Jeffrey Scott Holland

Shareef Fathi Alshinnawi

Gary David Cudak

Vinod Kamath

Bejoy J Kochuparambil

Aparna Vallury

Pradeep Ramineni

Arvind Modekurti

Paul Theodore Artman

James Scott Womble

Jim Drake

Leo H Webster

Timothy Andreas Meserth

Glenn Edward Myrto

Chunjian Ni

Andrew Thomas Junkins

Alvin G Davis

James Robert Drake

Matthew Aaron Heller

Jean Jidong Xu

Mark McCool

Rachel Pollock

Arvind Modekeurti

Connor Raines

Lake Robert Maxwell

Tinashe Kucherera

Detecting coolant leaks in a server system including receiving, by a controller in the server system with nodes stacked vertically, a voltage fault alert from a first node; receiving, by the controller in the server system with nodes stacked vertically, a voltage fault alert from a second node located below the first node; and upon receiving the voltage fault alert from the first node and the voltage fault alert from the second node, powering down, by the controller, one or more nodes located below the second node.

System and method for detecting coolant leaks in a server system

A computer program product provides for obtaining first and second three-dimensional point clouds from first and second three-dimensional face images. The first three-dimensional point cloud is orthogonally projected onto a two-dimensional plane to form a first two-dimensional point cloud. A first set of initial correspondence points are identified in the first two-dimensional point cloud before orthogonally projecting the identified first set of initial correspondence points from the first two-dimensional point cloud back to the first three-dimensional point cloud to identify a first set of initial correspondence points in the first three-dimensional point cloud. An initial transformation matrix is determined that, when applied to the identified first set of initial correspondence points in the first three-dimensional point cloud, co-registers the first set of initial correspondence points and/or the first point cloud with a second set of initial correspondence points associated with the second three-dimensional point cloud and/or the second point cloud.

Selecting initial correspondences used in co-registration of face images

Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component are disclosed. According to an aspect, a cooling system includes a conduit configured to be in conductive heat transfer interface with an electronic component. The conduit is configured to transfer a first portion of heat from the electronic component to a flow of a cooling liquid. The heat transfer device is also configured to be in conductive heat transfer interface with the electronic component, and to transfer a second portion of heat from the electronic component. The cooling system includes a heat collector manifold configured to receive the flow of the cooling liquid with the first portion of heat from the conduit, to receive the second portion of heat via conductive heat transfer from the heat transfer device, and to transfer the second portion of heat to the flow of the cooling liquid.

Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component

Cooling systems having cooling and augmentation loops for electronic components and related methods are disclosed. According to an aspect, a cooling system for an electronic component includes a cooling loop in thermal transfer interface with a first electronic component. The cooling loop is configured to contain a first flow of a cooling liquid between an inlet and an outlet. The cooling system also includes at least one augmentation loop configured to contain a second flow of the cooling liquid and alternately engage and disengage with respect to the cooling loop, such that engaging the augmentation loop to the cooling loop converts a series flow pattern with the first flow of the cooling liquid into a parallel flow pattern of a portion of the first flow of the cooling liquid with the second flow of the cooling liquid, without disconnection of the cooling loop from the inlet and outlet.

Cooling systems having cooling and augmentation loops for electronic components and related methods

A combination heat sink/air director apparatus includes conduction plates extending into gaps between dual in-line memory module ('DIMM') installed in computing device. A plurality of thermal interface material (“TIM”) pads are coupled to each side of each of the plurality of conduction plates. A heat sink thermally is coupled to the conduction plates and mounted above the conduction plates. Air impedance of air flow through an interface includes air flow to the heat sink is selected to balance air flow between the interface and components adjacent to the interface. A chosen percentage of air flow passes through the interface for the balance of air flow. Each conduction plate and the TIM pads coupled to each side of the conduction plate are sized to contact and thermally couple to the DIMMs of the plurality of DIMMs on either side of the conduction plate and associated TIM pads.

High-capacity memory air cooling device

Method, system, and computer program product embodiments of heating a flow of liquid by transfer of heat with computing devices. Embodiments also include determining a dynamic cooling capacity index for each of the computing devices, and allocating processing workload among the first computing device and the second computing device based on the dynamic cooling capacity indexes of the computing devices. Embodiments further include allocating workload and/or regulating flow rate of the flow of liquid to maintain a predetermined value or range of values of temperature of the liquid.

Optimizing waste heat recovery and return water temperature using dynamic flow control based on server power profiles and cooling capacity of servers

An apparatus for a hybrid single-phase/two-phase cooling loop to enhance cooling of components in a computing device is disclosed. The apparatus includes a single-phase cooling loop routed through a first part of a component. The component includes semiconductor devices. The single-phase cooling loop includes a fluid configured to remain in a liquid state after removing heat from the first part of the component. The apparatus includes a two-phase cooling loop routed through a second part of a component. The two-phase cooling loop includes a dielectric fluid configured to at least partially transition from a liquid state to a gas state at a selected temperature of a semiconductor device of the second part of the component while removing heat from the second part of the component.

Hybrid single-phase/two-phase cooling loop to enhance cooling of components

Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.

Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof

Integrated Thermal Interface Detachment Mechanism for Inaccessible Interfaces are disclosed. According to an aspect, an exemplary device for an electronic component having a thermal interface material, comprising a heat sink configured to contact the thermal interface material and configured to heat transfer interface with the electronic component while the thermal interface material is in contiguous contact with both the heat sink and the electronic component, and a separator mechanism configured to advance a separator ram with respect to the heat sink and effect a force upon the thermal interface material, such that advancing the ram breaks the contiguous contact of the thermal interface material with at least one of the heat sink and the electronic component.

Integrated thermal interface detachment mechanism for inaccessible interfaces

Devices and methods for adjusting the position of liquid cooling system infrastructure of a computing system comprising liquid-cooled memory modules to provide improved systems and techniques for servicing liquid-cooled memory modules are disclosed herein. According to an aspect, a device includes a table section, a handle on a first side of the table section, and a spreader section on a second side of the table section opposite from the first side, the spreader section further comprising a profile. The profile of the spreader section comprises a first pair of a flat surfaces parallel to each other, defining a first width. The profile of the spreader section further comprises a second pair of flat surfaces parallel to each other, defining a second width perpendicular to the first width, the second width being longer than the first width. The profile of the spreader section also comprises a pair of curved transition sections on opposite corners of the profile, each transition section configured to controlled adjustment with progressive incremental radius increments between an adjacent surface from each of the first pair and second pair of surfaces, such that the device is adapted to insertion with respect to a gap between cooling elements of a double-sided memory module cooling system, and is configured to be rotated to adjust the position of the cooling elements.

Liquid cooled memory module service device for systems with multiple memory module thicknesses and methods of using the same

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same

Automatically cooling computer system components for safe servicing includes: determining that a target component of a plurality of components is to be serviced; and reducing temperature of one or more components of said plurality of components if such one or more components exceeds a threshold temperature and such one or more components are within a predefined area of the target component.

Automatically cooling computer system components for safe servicing

Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments are disclosed. According to an aspect, a method includes using a cool sink to transfer thermal energy from an environment. The method also includes using a thermal energy transfer device to transfer the thermal energy to liquid within a conduit. Further, the method includes transporting the liquid containing the transferred thermal energy away from the environment such that the thermal energy within the environment is reduced.

Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments

An apparatus, method, and program product are disclosed for loading a program during boot of a device. A monitor module collects usage data for each of one or more programs executing on a device. The usage data for each program comprising an amount of time that the program was used and a schedule of when the program was used. A priority module assigns a boot priority to each of the one or more programs based on the amount of time that each program was used. A boot module selects one or more programs to load during a boot period for the device based on each program's usage schedule. The one or more selected programs are loaded according to each selected program's boot priority.

Growing community of inventors

Newton, NC, United States of America

Jeffrey Scott Holland