Micron Technology Incorporated

Jeffrey S McNeil, Jr

Kishore Kumar Muchherla

Giuseppina Puzzilli

Jeremy Binfet

Akira Goda

Gil Golov

Todd A Marquart

Mark Alan Helm

Carmine Miccoli

Niccolo' Righetti

Violante Moschiano

Vamsi Pavan Rayaprolu

Eric N Lee

Ashutosh Malshe

Karl David Schuh

Niccolo′ Righetti

Sivagnanam Parthasarathy

Patrick Robert Khayat

Jonathan Scott Parry

James Fitzpatrick

Tomoko Ogura Iwasaki

Jiangang Wu

Lawrence Celso Miranda

Sheyang Ning

Sundararajan Sankaranarayanan

Jung-Sheng Hoei

Lakshmi Kalpana Vakati

Sead Zildzic, Jr

Sead Zildzic

Tommaso Vali

Huai-Yuan Tseng

Jung Sheng Hoei

Michele Incarnati

Ugo Russo

Walter Di Francesco

Umberto Siciliani

Daniel J Hubbard

Phong Sy Nguyen

Silvia Beltrami

Giovanni Maria Paolucci

Jason Lee Nevill

Dave Scott Ebsen

Paing Z Htet

Junwyn A Lacsao

Lakshmi Kalpana K Vakati

Kishore Kumar Muccherla

Robert Loren O Ursua

Described are systems and methods for validating read level voltage in memory devices. An example memory device comprises: a memory array comprising a plurality of memory cells electrically coupled to a plurality of wordlines; and a controller coupled to the memory array, the controller to perform operations comprising: causing a read level voltage to be applied to a specified wordline of the plurality of wordlines; receiving an actual bit count reflecting a number of memory cells that have their respective threshold voltages below the read level voltage; and responsive to determining that a difference of an expected bit count and the actual bit count exceeds a predetermined threshold value, adjusting the read level voltage.

Validating read level voltage in memory devices

Control logic in a memory device initiates a program operation including application of a set of programming pulses to a wordline associated with one or more memory cells of a memory array to be programmed to a set of programming levels, where each programming level of the set of programming levels is programmed by each programming pulse. The control logic determines that a program voltage of a programming pulse of the set of programming pulses reaches a maximum program voltage level. In response to the determining, during a subsequent programming pulse following the programming pulse, adjusting a first voltage associated with boosting a pillar voltage, a second voltage applied to a bitline, and a third voltage applied to the wordline to establish a subsequent program voltage of the subsequent programming pulse that is below the maximum program voltage level.

Establishing bitline, wordline and boost voltages to manage a maximum program voltage level during all levels programming of a memory device

A method performed by a processing device receives a plurality of write operation requests, where each of the write operation requests specifies a respective one of the memory units, identifies one or more operating characteristic values, where each operating characteristic value reflects one or more memory access operations performed on a memory device, and determines whether the operating characteristic values satisfy one or more threshold criteria. Responsive to determining that the operating characteristic values satisfy the one or more threshold criteria, the method performs a plurality of write operations, where each of the write operations writes data to the respective one of the memory units, and performs a multiple-read scan operation subsequent to the plurality of write operations, where the multiple-read scan operation reads data from each of the memory units.

Workload-based scan optimization

Control logic in a memory device determines to initiate a string read operation on a first memory string of a plurality of memory strings in a block of a memory array, the block comprising a plurality of wordlines, wherein the first memory string is designated as a sacrificial string. The control logic further causes a read voltage to be applied to each of the plurality of wordlines concurrently and senses a level of current flowing through the sacrificial string while the read voltage is applied. In addition, the control logic identifies, based on the level of current flowing through the sacrificial string, whether a threshold level of read disturb has occurred on the block.

Sacrificial strings in a memory device to detect read disturb

A system can include a memory device and a processing device, operatively coupled with the memory device, to perform operations including reading a first copy of data stored in a first set of memory cells comprising a first memory cell, determining whether a threshold voltage of the first memory cell is within a first range of threshold voltages, responsive to determining that the threshold voltage of the first memory cell is within the first range of threshold voltages, reading a second copy of the data stored in a second set of memory cells comprising a second memory cell, determining whether a threshold voltage of the second memory cell is within a second range of threshold voltages, and responsive to determining that the threshold voltage of the second memory cell is outside the second range, using the second copy of the data.

Using duplicate data for improving error correction capability

Described are systems and methods for all level coarse/fine programming of memory cells. An example memory device comprises: a memory array comprising a plurality of memory cells electrically coupled to a plurality of wordlines and a plurality of bitlines; and a controller coupled to the memory array, the controller to perform operations comprising: identifying a set of memory cells for performing a memory programming operation, wherein the memory cells are electrically coupled to a target wordline and a set of target bitlines; causing a first voltage to be applied to the target wordline, wherein the first voltage is incremented every time period over a number of time periods that corresponds to a number of threshold voltages to be programmed; causing a second voltage to be applied to a first bitline over the number of time periods; causing a third voltage to be applied to a second bitline, wherein the third voltage is incremented during a second time period of the number of time periods, wherein the second time period follows a first time period; causing a fourth voltage to be applied to a third bitline, wherein the fourth voltage is incremented during a third time period of the number of time periods, wherein the third time period follows the second time period; and causing a fifth voltage to be applied to a fourth bitline over the number of time periods.

All level coarse/fine programming of memory cells

A memory array includes a block including wordlines, bitlines, and strings each connected to a respective bitline. The block is divided into a sub-blocks. Each sub-block includes a respective set of the strings, and each string of the set of strings is located at a sub-block position within its respective sub-block. Control logic performs operations including selecting each sub-block, causing a first voltage to be applied to a dummy wordline to activate a first set of dummy cells and deactivate a second set of dummy cells, and causing a second voltage to be applied to a selected wordline. Each sub-block includes a single string corresponding to an open string connected to a dummy cell of the first set of dummy cells. The second voltage causes data to be read out from each open string to a respective page buffer.

Parallelized defect detection across multiple sub-blocks in a memory device

Described are systems and methods for concurrent slow-fast memory cell programming. An example memory device comprises: a memory array comprising a plurality of memory cells electrically coupled to a plurality of wordlines and a plurality of bitlines; and a controller coupled to the memory array, the controller to perform operations comprising: identifying a set of memory cells for performing a memory programming operation, wherein the set of memory cells are electrically coupled to a target wordline and one or more target bitlines; causing a first programming pulse to be performed by applying a first programming voltage to the target wordline; classifying, by a processing device, the set of memory cells into a first subset of memory cells and a second subset of memory cells based on their respective threshold voltages; causing a first bias voltage to be applied to a first target bitline connected to the first subset of memory cells; causing a second bias voltage to be applied to a second target bitline connected to the second subset of memory cells; and causing a second programing voltage to be applied to the target wordline, wherein the second programming voltage exceeds the first programing voltage.

Concurrent slow-fast memory cell programming

A system includes a memory device including a memory array and control logic, operatively coupled with the memory array, to perform operations including receiving a set of commands to concurrently program a set of cells of the memory array with dummy data, the set of cells corresponding to a group of retired wordlines of the plurality of wordlines, in response to receiving the set of commands, obtaining the dummy data, and concurrently programming the set of cells with the dummy data by causing a ganged programming pulse to be applied to the set of cells.

Concurrent programming of retired wordline cells with dummy data

A system includes a memory device including a plurality of groups of memory cells and a processing device that is operatively coupled to the memory device. The processing device is to receive a request to determine a reliability of the plurality of groups of memory cells. The processing device is further to perform, in response to receipt of the request, a scan operation on a sample portion of the plurality of groups of memory cells to determine a reliability of the sample portion that is representative of the reliability of the plurality of groups of memory cells.

Memory sub-system scan

Memory devices might include an array of memory cells, a plurality of access lines, and control logic. The array of memory cells includes a plurality of strings of series-connected memory cells. Each access line of the plurality of access lines is connected to a control gate of a respective memory cell of each string of series-connected memory cells of the plurality of strings of series-connected memory cells. The control logic is configured to: open the array of memory cells for multiple read operations; read first page data from respective memory cells coupled to a selected access line of the plurality of access lines; read second page data from the respective memory cells coupled to the selected access line; and close the array of memory cells subsequent to reading the first page data and the second page data.

Memory devices for multiple read operations

A memory device comprising an array of memory cells organized into a set of sub-blocks and a set of wordlines. Control logic is operatively coupled with the array of memory cells, the control logic to perform operations including: receiving a program command from a processing device, the program command including information indicative of a physical address associated with a retired wordline of the set of wordlines; in response to detecting the information within the program command, generating dummy data that is one of pseudo-random data, all one values, or all zero values; and causing the dummy data to be programmed to memory cells of multiple sub-blocks of the set of sub-blocks that are selectively connected to the retired wordline.

Program command generation with dummy data generation at a memory device

Control logic in a memory device causes a first pulse to be applied to a plurality of word lines coupled to respective memory cells in a memory array during an erase operation. The control logic further causes a second pulse to be applied to a first set of word lines of the plurality of word lines to bias the first set of word lines to a first voltage. The control logic can cause a third pulse to be applied to a second set of word lines of the plurality of word lines to bias the second set of word lines to a second voltage and cause a fourth pulse to be applied to a source line of the memory array to erase the respective memory cells coupled to the first set of word lines and to program the respective memory cells coupled to the second set of word lines.

Programming selective word lines during an erase operation in a memory device

A method includes receiving, by control logic of a memory device, a copyback clear command from a processing device; causing, in response to the copyback clear command, a page buffer to perform a dual-strobe read operation on first memory cells configured as single-level cells, the dual-strobe read operation including a soft strobe at a first threshold voltage and a hard strobe at a second threshold voltage that are sensed between threshold voltage distributions of the first memory cells; causing the page buffer to determine a number of one bit values within the threshold voltage distributions detected in a threshold voltage range between the first/second threshold voltages; and causing, in response to the number of one bit values not satisfying a threshold criterion, a copyback of data in the first memory cells to second memory cells configured as high-level cells without intervention from the processing device.

Copyback clear command for performing a scan and read in a memory device

A system can include a processing device operatively coupled with the one or more memory devices, to perform operations that include writing data to the one or more memory devices and performing one or more scan operations on a management unit containing the data to determine a current value of a chosen data state metric. Each scan operation can be performed using a corresponding predetermined read-time parameter value. The operations can include determining whether the current value of the chosen data state metric satisfies a criterion, and can also include, responsive to determining that the current value of the chosen data state metric satisfies the criterion, selecting a remedial operation by determining whether redundancy metadata is included in a fault tolerant data stripe on the one or more memory devices. The operations can also include performing the remedial operation with respect to the management unit.

Two-tier defect scan management

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Nampa, ID, United States of America

Jeffrey S McNeil, Jr