Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Jeffrey R Pollard

Chien-Hua Chen

Michael W Cumbie

Eric Lee Nikkel

Jeremy Harlan Donaldson

Jeffrey Scott Obert

Jeff Hess

Charles Craig Haluzak

Si-lam Choy

Mehrgan Khavari

Tsuyoshi Yamashita

Shen Buswell

Si-Iam J Choy

Rio Rivas

Garrett E Clark

James Elmer Abbott, Jr

Matthew David Giere

Michael D Miller

Dustin W Blair

Jeremy Sells

John R Sterner

Satya Prakash

Graeme Scott

Kirby Sand

Thomas E Pettit

Mark C Huth

James Denning Smith

Si-Lam J Choy

Henry Kang

Charles Otis

Jacob Lum

David Cahill

Declan John O'Reilly

Noel McLoughlin

Nichole Godwin

Jacob M Lum

James Elmer Abbott

A fluid ejection die may include a fluid actuator, a substrate supporting the fluid actuator, a chamber layer supported by the substrate and a bypass passage in the substrate. The substrate may include a closed inlet channel having an inlet opening for connection to an outlet of a fluid source and an outlet channel having an outlet opening of a first size for connection to an inlet of the fluid source. The chamber layer includes a recirculation passage to supply fluid for ejection by the fluid actuator through an ejection orifice and to circulate fluid across the fluid actuator from the closed inlet channel to the outlet channel. The bypass passage is of a second size less than the first size and connects the inlet channel to the inlet of the fluid source while bypassing any fluid actuator provided for ejecting fluid through an ejection orifice.

Recirculation bypass

In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.

Fluidic ejection dies with enclosed cross-channels

In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.

Fluidic ejection devices with enclosed cross-channels

A die may, in an example, include at least one cross-die recirculation channel formed into the die to recirculate an amount of printing fluid therethrough, the cross-die recirculation channel including a first-sized inlet port and a first-sized outlet port formed on a first side of the die, at least one chamber recirculation channel formed into the die and fluidically coupled to the cross-die recirculation channel to recirculate an amount of printing fluid therethrough, the chamber recirculation channel including a second-sized inlet port and a second-sized outlet port, at least one pump formed within the chamber recirculation channel to recirculate the amount of printing fluid therethrough.

Cross-die recirculation channels and chamber recirculation channels

In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an army of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an army of enclosed cross-channels. Each enclosed cross-channel of the army of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.

In one example, a piezoelectric actuator includes a piezoelectric material, a first conductor on a first part of the piezoelectric material, and a membrane bonded to the first conductor with an adhesive. The first conductor has a root mean square surface roughness of at least 10 nm at the bonding interface with the membrane.

Piezoelectric actuator and method of making a piezoelectric actuator

Electromagnetic radiation is transmitted through a piezoelectric material and is absorbed in at least an adhesive that bonds the piezoelectric material to another material. Absorbing the electromagnetic radiation in the adhesive ablates the adhesive and the ablation of the adhesive acts to remove the piezoelectric material.

Removing piezoelectric material using electromagnetic radiation

A fluid ejection device includes a flexible membrane, an adhesive layer, a piezoelectric material layer, and first and second electrically conductive layers. The adhesive layer and the piezoelectric material layer include edge regions and central regions. A surface of the edge region of the piezoelectric material layer is coplanar with a surface of the edge region of the adhesive layer. The first electrically conductive layer is between the piezoelectric material layer and the adhesive layer such that a surface of the first electrically conductive layer is coplanar with the surface of the edge region of the piezoelectric material layer and the surface of the edge region of the adhesive layer. The second electrically conductive layer is over the surface of the edge region of the piezoelectric material layer, the surface of the edge region of the adhesive layer, the surface of the first electrically conductive layer, and the flexible membrane.

Fluid ejection device

A fluid ejection device includes a flexible membrane and an adhesive layer on the flexible membrane. The adhesive layer includes a first region and a second region extending from the first region. The fluid ejection device includes a piezoelectric material layer including an edge region and a central region. A surface of the edge region of the piezoelectric material layer is substantially coplanar with a surface of the second region of the adhesive layer. The surface of the edge region and the surface of the second region are substantially parallel with the flexible membrane.

The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first region of the feature along a first liquid supply path and supplying liquid to at least a second different region of the feature along at least a second liquid supply path.

Laser micromachining and methods of same

The described embodiments relate to laser micromachining a substrate. One exemplary embodiment removes substrate material from a substrate to a first depth relative to a first surface of the substrate while delivering an assist gas at a first flow rate; and, removes substrate material at a second greater depth while delivering the assist gas at a second higher flow rate.

A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.

Packaged MEMS device assembly

Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a structure contains a plurality of slots in a substrate. The structure also has a trench in the substrate contiguous with the plurality of slots to form a compound slot.

Slotted substrates and methods and systems for forming same

A method of laser machining a fluid slot includes directing a UV laser beam towards a substrate with microelectronics to form a slot through the substrate.

Method of laser machining a fluid slot

The described embodiments relate to slotted substrates and methods of forming same. One exemplary method forms a first slot portion into a first surface of a substrate, the first slot portion defining a footprint at the first surface. The method also forms a second slot portion through the first slot portion; and, forms a third slot portion through a second surface of the substrate sufficiently to intercept the second slot portion to form a fluid-handling slot through the substrate.

Growing community of inventors

Corvallis, OR, United States of America

Jeffrey R Pollard