Curative Sound, LLC

Lucent Technologies Inc.

At+t Corp.

At&t Bell Laboratories

Mwm Acoustics, LLC

Other

Harman International Industries, Inc.

Mwm Mobile Products, LLC

Jeffrey Phillip McAteer

John C Baumhauer, Jr

Alan Dean Michel

Randal Douglas Wood

Geoffry N Barber

James V Olson

Christopher Todd Welsh

Matthew C Haws

Joshua R Barber

Christopher T Welsh

Kevin D Willis

Gary Wayne Elko

Medford Alan Dyer

James Edward West

Brian Albert Wittman

Larry Allen Marcus

Robert A Kubli

Richard M Sachs

Joshua James Barr

Frederick A Rosebrock

Gregory S Hinzmann

Mark Starr Kimbrough

William Joseph McLaughlin

Dennis Jay Wasserman

Samuel C Welsh

A platelet-rich plasma (PRP) activation system for activating PRP contained in a container includes a housing, a power supply, a piezoelectric transducer array, a support structure, and a coupling medium. The power supply is located in the housing. The piezoelectric transducer array is operably connected to the power supply and is located in the housing. The piezoelectric transducer array is configured to generate a focused shock wave using power from the power supply. The support structure is operably connected to the housing and is configured (i) to receive the container, and (ii) to position the container at least partially within the housing, such that at least a portion of the PRP is located at a focal volume formed by the focused shock wave. The coupling medium is located in the housing and is positioned between the piezoelectric transducer array and the container.

Platelet-rich plasma activation system and method

Handheld shock wave device

A focused extracorporeal shock wave therapy (f-ESWT) system includes an f-ESWT device and a plurality of interchangeable standoff structures. The f-ESWT device includes a housing. The f-ESWT device is configured to generate a focused shock wave as a combination of a plurality of individual shock waves. Each standoff structure is configured for removable connection to the housing to receive and to transmit the plurality of individual shock waves. Each standoff structure of the plurality of interchangeable standoff structures includes a rigid exterior shell defining a shell space, and an elastomeric interior at least partially located in the shell space. The plurality of individual shock waves is transmitted through the rigid exterior shell and the elastomeric interior of a selected standoff structure of the plurality of interchangeable standoff structures that is removably connected to the housing.

Handheld focused extracorporeal shock wave therapy device, kit, and method

A method of generating a focused shock wave with a handheld focused extracorporeal shock wave therapy (f-ESWT) device includes driving a plurality of piezoelectric elements to generate a focused shock wave based on a first plurality of time delays when a first standoff structure is removably connected to a handheld housing of the f-ESWT device, and driving the plurality of piezoelectric elements to generate the focused shock wave based on a second plurality of time delays when a second standoff structure is removably connected to the handheld housing of the f-ESWT device, the second plurality of time delays different from the first plurality of time delays, and the second standoff structure different from the first standoff structure.

A focused extracorporeal shock wave therapy (f-ESWT) device includes a handheld housing, a battery, and a transducer assembly. The battery is located in the handheld housing. The transducer assembly is located in the handheld housing and is operably connected to the battery. The transducer assembly is configured to generate a focused shock wave using electrical energy from the battery.

A handheld focused extracorporeal shock wave therapy (f-ESWT) device includes a plurality of piezoelectric elements, a power supply circuit, and a plurality of driver circuits. The piezoelectric elements are each configured to generate an individual shock wave. The power supply circuit is configured to output a first DC voltage and a second DC voltage. The first DC voltage greater than the second DC voltage. The driver circuits are each operably connected to the first DC voltage, the second DC voltage, and to a corresponding piezoelectric element of the plurality of piezoelectric elements. Each driver circuit includes a switching element electronically configurable in an open state and in a closed state. When the switching element is in the open state, the first DC voltage and the second DC voltage are applied to the corresponding piezoelectric element to pre-charge the corresponding piezoelectric element with a DC pre-charge voltage having a first polarity.

Platelet-rich plasma activation device

Shock wave standoff assembly

A transducer assembly utilizing at least two MEMS transducers is provided, the transducer assembly preferably defining either an omnidirectional or directional microphone. In addition to at least first and second MEMS transducers, the assembly includes a signal processing circuit electrically connected to the MEMS transducers, a plurality of terminal pads electrically connected to the signal processing circuit, and a transducer enclosure housing the first and second MEMS transducers. The MEMS transducers may be electrically connected to the signal processing circuit using either wire bonds or a flip-chip design. The signal processing circuit may be comprised of either a discrete circuit or an integrated circuit. The first and second MEMS transducers may be electrically connected in series or in parallel to the signal processing circuit. The first and second MEMS transducers may be acoustically coupled in series or in parallel.

Dual cell MEMS assembly

A surface mountable package for use with an audio transducer is provided. In addition to the audio transducer, the surface mountable package includes a substrate, a cover, and a transducer support frame mounted within, and attached to, the substrate and cover. The support frame includes one or more cavities that, in combination with the audio transducer, substrate and cover, define the front and rear acoustic cavity volumes.

Transducer package with interior support frame

An omnidirectional electret condenser microphone element with improved low frequency background ambient acoustical noise rejection is provided. The omnidirectional electret condenser microphone element includes a plurality of passageways in acoustic series that couple at least one acoustic aperture of the microphone element to an acoustic cavity formed within the microphone element. At least one of said plurality of passageways is of a predefined size that is determined to provide the desired response roll-off within a predefined frequency range. In at least one preferred configuration, the roll-off resulting from the plurality of passageways is greater than 2.0 dB between 300 and 100 Hz. In at least one alternate preferred configuration, the roll-off resulting from the plurality of passageways is greater than 3.0 dB between 300 and 100 Hz.

Controlled leakage omnidirectional electret condenser microphone element

A surface mountable transducer package is provided, the design of which allows a thin package profile to be achieved. An encapsulation layer bonds to a surface of each of the terminal pads and encapsulates a portion of the transducer and at least a portion of the signal processing IC.

Transducer package with transducer die unsupported by a substrate

A transducer package fabrication process is provided, the completed transducer package achieving a thin package profile. The fabrication process utilizes an encapsulation material to eliminate the need for a transducer support substrate, the encapsulation material isolating the terminal pads from one another while holding the transducer and signal processing IC in position.

Method for fabricating a transducer package with the transducer die unsupported by a substrate

The microphone system for communication devices that comprises an electric circuit comprising two microphone elements connected to a signal flow processor. This processor uses a digital signal processor or comparable analog circuitry to provide a particular electrical time delay (&#x3c4;) to one of the microphone elements (nearest the ear or loudspeaker) and a compatible amplitude gain (Gm) to the other microphone element (nearest the user's mouth) in order to substantially reduce the external acoustic coupling and echo of communication devices in the receive and doubletalk state. Further, this processing system allows the microphone system to reduce the pickup of ambient noise in the send and idle state, while still being sensitive to the user's speech.

Microphone system for communication devices

Growing community of inventors

Carmel, IN, United States of America

Jeffrey Phillip McAteer