Raytheon Company

Jeffrey Paquette

Scott R Cheyne

Joseph R Ellsworth

Michael P Martinez

Dennis W Mercier

Mark Ackerman

Angelo M Puzella

Craig H McCordic

John Sangiolo

John D Walker

Dimitry Zarkh

Michael R Trahan

A low profile, low loss, wide band, wide scan volume radome assembly is provided for an antenna. The radome assembly includes a fabric radome element disposable over the antenna, first radome securing elements securably embedded within the fabric radome element and second radome securing elements securably embedded within the antenna. The second radome securing elements are respectively engageable with the first radome securing elements to thereby secure the fabric radome element over the antenna.

Radome assembly

A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.

Translating hinge

A reverse wedgelock device with multiple draw blocks disposed about a lead screw passing through the draw blocks, wherein the draw blocks may be compressed together and caused to displace about respective wedge surfaces upon tightening of the screw. Compression and displacement of the draw blocks can function to draw anchors associated with the draw blocks inward, which, when engaged with opposing objects, functions to draw the objects together.

Reverse wedgelock device

In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.

Modular architecture for scalable phased array radars

A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

Heat sink interface having three-dimensional tolerance compensation

In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Assembly to provide thermal cooling

In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system further includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.

Cooling of coplanar active circuits

In one aspect, a busbar connector includes first and second portions. Each portion includes a rigid member forming an exterior portion of the busbar connector, a conduction member forming an interior portion of the busbar connector and a compliant member having a stiffness less than the rigid member and including a first surface attached to the rigid member and a second surface opposite the first surface attached to the conduction member. The busbar connector also includes a fastener structure configured to secure a first busbar and a second busbar between and in contact with the conduction members of the first and second portions to allow current to flow between the first and second busbars.

Busbar connector

In one aspect, an electrical connector to connect circuit cards includes a compliant member that includes a first end portion and a second end portion, a first rigid member attached to the first end portion of the compliant member and including a first bore extending along an axis, a second rigid member attached to the second end portion of the compliant member and including a second bore extending along the axis and a pin secured in the first bore and configured to move within the second bore. The compliant member is configured to translate along the axis from a first position corresponding to the first and second rigid members being separated to a second position corresponding to the first and second rigid members being in direct contact.

Growing community of inventors

Wakefield, MA, United States of America

Jeffrey Paquette