Avago Technologies General IP (singapore) Pte. Ltd.

Jeffrey P Tobin

Michael G Kelly

Mark David Johnson

William H Sisson

A circuit board includes a substrate defining a substantially planar surface, a first electrical component, a second electrical component, and an interconnect. The first electrical component is coupled to the substrate. The second electrical component is spaced from the first electrical component and is coupled to the substrate. The interconnect is formed on the substantially planar surface of the substrate and extends between the first electrical component and the second electrical component. The interconnect is formed by at least two layers of a conductive material.

Circuit board with multiple layer interconnect and method of manufacture

A method for cooling a circuit comprises generating movement of fluid along a path through a closed-loop system. The method further comprises inducing turbulence in the fluid by movement of at least a portion of a turbulence-inducing device arranged in the path, and dissipating thermal energy from the circuit by the fluid. A system comprises a circuit, and a closed-loop cooling system comprising fluid for cooling the circuit and at least one active turbulence-inducing device. In one embodiment, the turbulence-inducing device is a microelectromechanical system (MEMS) device. In one embodiment, the MEMS device is solely responsible for bulk fluid movement through the closed-loop cooling system.

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Loveland, CO, United States of America

Jeffrey P Tobin