Eastman-kodak Company

Jeffrey P Serbicki

Michael L Boroson

Peter G Bessey

John Schmittendorf

Joseph E Yokajty

Steven A Van Slyke

Ronald S Cok

Cheryl J Kaminsky

Glen C Irvin, Jr

John R Debesis

Lawrence A Rowley

James S Newkirk

Paul John Fleming

Wesley H Bacon

Peter J Harissis

Kenneth L Baker

A method of bonding a cover plate over OLED devices formed on a surface of a device substrate wherein each one of the OLED devices includes at least one electrical interconnect area includes providing a flow-preventing pattern on a surface of the cover plate or on the OLED devices absent from the electrical interconnect areas of the OLED devices to prevent flow of a flowable adhesive material into at least the outermost portions of such interconnect areas; dispensing a selected amount of a flowable curable adhesive material on the surface of the cover plate in registration with the flow-preventing pattern; engaging the cover plate in alignment with the substrate; and curing the adhesive material.

Method of making an OLED display device with enhanced optical and mechanical properties

A method of bonding a common cover plate over a plurality of OLED devices formed on a device substrate includes providing an unpatterned or a patterned layer of a pressure-sensitive adhesive (PSA) material over a surface of the cover plate; bonding the cover plate over the OLED devices; and singulating individual OLED devices having a bonded cover plate and permitting electrical access to electrical interconnects associated with each OLED device for attaching electrical leads thereto.

Method of fabricating a cover plate bonded over an encapsulated OLEDs

A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

Highly moisture-sensitive electronic device element and method for fabrication

An integrated touch screen and OLED flat-panel display includes a touch screen having a touch screen substrate with electrical contacts for receiving touch screen signals and conductive vias through the substrate and electrically connected to the electrical contacts; an OLED flat-panel display having a display substrate with electrical contacts for receiving display signals and an exposed area on the display substrate for providing electrical connection to the electrical contacts of the display and the touch screen; and wherein the touch screen substrate is the cover or substrate of the OLED flat-panel display, the conductive vias are electrically connected to conductors and electrical contacts located on the display substrate, and the substrate of the OLED flat-panel display protrudes beyond the cover to provide electrical connection to the electrical contacts of the display and touch screen.

Integrated touch screen and OLED flat-panel display

An effective desiccant for use in a package which has a material including at least in part solid particles of one or more materials, at least one of such materials having an average particle size range 0.001 to 0.1 micrometers to provide a high rate of water absorption and to provide an equilibrium minimum humidity level lower than a humidity level to which a highly moisture sensitive electronic device is sensitive within a sealed enclosure.

Desiccants and desiccant packages for highly moisture-sensitive electronic devices

A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.

Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps

A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

Sealing structure for highly moisture-sensitive electronic device element and method for fabrication

A method of desiccating an environment surrounding a moisture-sensitive electronic device sealed within an enclosure, includes selecting a desiccant comprised of solid particles having a particle size range 0.1 to 200 micrometers, the desiccant selected to provide an equilibrium minimum humidity level lower than a humidity level to which the device is sensitive within the sealed enclosure; choosing a binder that maintains or enhances the moisture absorption rate of the desiccant for blending the selected desiccant therein, the binder being in liquid phase or dissolved in a liquid; forming a castable blend including at least the desiccant particles and the binder, the blend having a preferred weight fraction of the desiccant particles in the blend in a range of 10% to 90%; casting a measured amount of the blend onto a portion of an interior surface of an enclosure to form a desiccant layer thereover, the enclosure having a sealing flange; solidifying the desiccant layer to a solid; and sealing the electronic device with the enclosure along the sealing flange.

Desiccation of moisture-sensitive electronic devices

An organic electroluminescent (EL) display panel is disclosed which has a protective cover sealed thereon with a radiation-cured perimeter seal. The organic EL display panel is formed on a radiation-transmissive substrate, and includes at least one metallized leader which is in electrical contact with at least one anode electrode or with at least one cathode electrode. The metallized leader has a patterned seal zone which defines radiation-transmissive apertures. A perimeter seal band is formed over the substrate and extends through the patterned seal zone of the metallized leader. A protective cover has a perimeter seal flange which mates with the perimeter seal band. A bead of a radiation-curable resin is in contact with the seal flange and with the display panel at the perimeter seal band. A source of curing radiation is directed to the bead of radiation-curable resin through the substrate and through the patterned seal zone for curing the bead so as to seal the protective cover on the organic EL display panel with an electrically insulative radiation-cured perimeter seal.

Organic electroluminescent display panel having a cover with

A laser print head structure includes a laser diode array (14) coupled to a heat sink (10). A cylindrical lens element (20) is aligned with the laser diode array and bonded to the heat sink. A binary optical element (22) is then aligned with the cylindrical lens element and attached to the heat sink through the use of flexures (24). The use of the flexures permits the binary optical element to 'float' in the plane of the laser diode array, thereby maintaining alignment even when the thermal expansion characteristics of the binary optical element are different from the thermal expansion characteristics of the heat sink. Anti-wicking slots (18) are provided in the heat sink at locations between the bonding points of the cylindrical lens element and the laser diode array. The anti-wicking slots, through capillary action, prevent excess adhesive from wicking along the cylindrical lens element and onto the facets of the lasers in the laser diode array. In addition, the flexures are provided with holes (28) to permit light to pass through the flexures to a light curable resin which is used to bond the flexures to the heat sink.

Optical print head with flexure mounted optical device

A flexible magnetic data storage disk with a ferromagnetic surveillance ring-shaped marker integrally bonded to the disk substrate around the central aperture. A series of slits are formed in the disk substrate under the marker to serve as 'tear initiators' if a user attempts to remove the surveillance marker thus rendering the disk unusable and thereby protecting the data on the disk from unauthorized removal from a secure area.

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Holley, NY, United States of America

Jeffrey P Serbicki