The International Nickel Company, Inc.

Mpd Technology Corporation

Jeffrey N Crosby

Richard N Rhoda

Robert S Hanley

A process is provided for preparing cis-[Pt(NH.sub.2).sub.3 (H.sub.2 O).sub.2 ](NO.sub.3).sub.2 by a process comprising preparing cis-Pt(NH.sub.3).sub.2 I.sub.2 from K.sub.2 PtI.sub.4 under controlled conditions of temperature and pH and converting the resultant cis-Pt(NH.sub.3).sub.2 I.sub.2 to the diaqua complex with AgNO.sub.3 under controlled conditions.

Preparation of cis-diamminediaquaplatinum(II) nitrate

A process for preparing cis - Pt (NH.sub.3).sub.2 I.sub.2 from K.sub.2 PtI.sub.4 by adding NH.sub.4 OH under controlled conditions of temperature and pH.

Preparation of cis-diammine diodo platinum (II)

The invention provides a method of electrodepositing palladium on a substrate e.g. an electrical switch contact, to give a coating having low transverse porosity and good slip wear resistance. The method involves electrodepositing a first layer from an alkaline bath containing a cationic palladium ammine complex and then electrodepositing on the first layer a second layer from an acid bath containing an anionic palladium nitrite complex.

Electrodeposited palladium, method of preparation and electrical contact

The invention provides a bath that is operable at, or close to, pH 7 to deposit a coating of ruthenium on a substrate, e.g. the contacts of electrical switches, which does away with the need to provide a protective coating on the substrate prior to ruthenium plating. The bath consists essentially of (i) a compound or a complex that contains a nitrogen bridge linkage joining together two ruthenium atoms and (ii) an aqueous solution of oxalic acid or an oxalate.

Ruthenium electroplating and baths and compositions therefor

A process is provided for preparing cis-Pt(NH.sub.3).sub.2 Cl.sub.2 and intermediates. As a step in the process the intermediate cis-Pt(NH.sub.3).sub.2 I.sub.2 is prepared from K.sub.2 PtI.sub.4 by adding NH.sub.4 OH under controlled conditions of temperature and pH. The cis-Pt(NH.sub.3).sub.2 Cl.sub.2 is provided in high yield and purity.

Preparation of platinum complexes

A process for chemical vapor deposition of ruthenium on heat resistant substrates employing ruthenium 1, 3 dione compounds as volatile sources and causing the volatile material to impact on a heated receiving substrate in random fashion in a quiescent, low-pressure atmosphere.

Chemical vapor deposition

Articles are electroplated with ruthenium in plating bath containing ruthenium cationic complex [Ru.sub.2 N(NH.sub.3).sub.8 X.sub.2 ].sup.3+. Bath provides advantages of enabling plating in alkaline solution, where desired, and avoids difficulties of protecting articles against attack by acid electrolyte baths.

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Worcester, United Kingdom

Jeffrey N Crosby