Corning Incorporated

Jeffrey Mathew Clark

Garrett Andrew Piech

John T Keech

Michael Lucien Genier

Kristopher Allen Wieland

Windsor P Thomas

John Tyler Keech

Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same

An image mask and image mask assembly. The image mask includes a glass substrate having a thickness of less than 2 mm and a patterned mask disposed on a surface of the glass substrate. The image mask assembly includes a transparent backer plate coupled to the glass substrate. Methods of writing a pattern on a glass sheet and writing a master pattern into a layer comprising a mask material are also provided.

Image mask and image mask assembly

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Corning, NY, United States of America

Jeffrey Mathew Clark