Silicon Graphics, Incorporated

Cray Research, Inc.

Silicon Graphics International Corporation

Jeffrey Mark Glanzman

Perry D Franz

David Collins

Steven J Dean

Steve Dean

Timothy Scott McCann

Timothy S McCann

George M Hopkins

Larry Hayes Wood

A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.

Closed-loop cooling system for high-density clustered computer system

A ground bracket and method for grounding an electronic device to a structure such as a rail, rack or cabinet. According to one aspect of the invention the ground bracket has a first conductive surface for use in coupling the bracket to the structure and an arcuate portion conductively coupled to the first conductive surface for contacting an electronic device. In another embodiment, a bracket includes a first surface for coupling to a rack, and a portion positioned proximal a computer component that includes a rotatable fastening mechanism for coupling to the computer component.

Housing ground bracket and method

An improved support bracket for supporting electronic devices provides improved adjustability and alignment. The support bracket includes a front surface and a rear surface each including a portion having at least one threaded hole and a support portion between the front surface and rear surface for supporting an electronic device. The support bracket includes a side portion having a mechanism for coupling the side portion to a structure, a guide portion and a support portion for supporting an electronic device.

Electronic device support and method

A rack including a rail for supporting a computer module and a grounding element electrically coupled to the rack and positioned to electrically contact a computer module inserted in the rack such that the grounding element provides a path to ground. The grounding element can be an arcuate bracket attached to the rail to make contact with a side of the computer module. The grounding element can be a conductor extending from the rack and positioned to make contact with a side of the computer module. The rack can include a wider section which provides a cabling channel and a member on the rack for mechanically coupling the rack to an adjacent rack. The rack can include at least one passage for allowing a cable to pass through the rack to an adjacent rack and a cable organizer for maintaining placement of at least one cable routed through the passage.

Computer module mounting system and method

An input/output module functioning as a peripheral channel adapter or gateway to a network in a high speed digital processing system, the input/output module including a plurality of circuit board assemblies and an enclosure for enclosing the circuit board assemblies, the enclosure including a frame having side panels which are hinged to the frame on opposite sides thereof and movable between closed and open positions for providing access to the circuit board assemblies, a plurality of the input/output modules are enclosed within a housing made of metal, that provides EMI shielding for the input/output modules, the enclosures for the plurality of input/output modules defining metal bulkheads within the housing, and a blower located within the housing forwardly of the input/output modules for circulating cooling air through the input/output modules, the input/output modules being configured so that the volume of cooling air supplied to the application specific assemblies is greater than the volume of cooling air supplied to the power supply assembly.

Growing community of inventors

Mondovi, WI, United States of America

Jeffrey Mark Glanzman