Kistler Holding Ag

Kistler Instrument Corporation

Jeffrey M Schnellinger

Christof Sonderegger

Michael D Insalaco

Jochen Von Berg

Ulrich Albicker

Rene Tanner

Andrew Crawford

Peter Meister

René Tanner

A piezoresistive sensor chip element of a pressure sensor has lower face with an outer edge, an adhesion area and a non-adhesion area. The chip has a closed chip cavity for measuring the pressure of a medium flowing around the chip. The upper face of a substrate is fastened only at the adhesion area of the chip. The non-adhesion area extends at least over a circular area arranged centrally on the lower face and covers a third of the lower face's total area and extends over at least one connection area from the circular area to the edge of the lower face. The pressure in the pressure medium can spread through the connection area into a space under the non-adhesion area on the element lower face. The substrate has a recess located centrally under the sensor chip element.

Pressure sensor having a piezoresistive sensor chip element

A sensor including a center post extending along the sensing axis of the sensor, a piezoelectric sensing element concentrically engaging the center post, and a preload element preloading the piezoelectric element radially outward to the axis. The center post includes a recess along the axis and the first preload element is in the recess and preloads the piezoelectric element radially outward. The sensor may include a mass concentrically engaging the piezoelectric element. The sensor senses acceleration, force or pressure.

Annual shear element with radial preload

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Akron, NY, United States of America

Jeffrey M Schnellinger