Motorola Corporation

Jeffrey M Petsinger

Gregory Joseph Dunn

Daniel T Rooney

Jovica Savic

Timothy B Dean

William R Ziemer

C Gregory Bujalski

An overmolded electronic assembly () is fabricated from one or more overmoldable interface components () that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.

Overmolded electronic assembly and overmoldable interface component

A dielectric sheet () includes a photodielectric support layer () that may be glass reinforced and a dielectric laminate (). The dielectric laminate includes first and second metal foil layers (), and a dielectric layer () disposed between the first and second metal foil layers. The first metal foil layer is adhered to the photodielectric support layer. In a printed circuit and patch antenna that includes the dielectric sheet, the first metal layer is patterned by removal of metal according to a circuit pattern and the photodielectric support layer is patterned by removal of dielectric material according to the circuit pattern.

Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit

An integrated patch antenna and electronics assembly () comprises an antenna dielectric layer (), a ground plane layer () disposed on a first side of the antenna dielectric layer, a printed circuit dielectric layer () disposed on the ground plane layer opposite the antenna dielectric layer, a patterned conductive metal foil layer () on a component surface () of the assembly (), and a conductive metal foil antenna patch () disposed on a second side of the antenna dielectric layer that is in a patch side () of the assembly. In some embodiments, a plated through hole () couples the antenna patch to the patterned conductive metal foil layer. In some embodiments, there are one or more printed circuit dielectric layers () disposed over the antenna patch on the antenna patch side of the assembly. In some embodiments, pairs of printed circuit dielectric layers ([]) are formed simultaneously on each side of the assembly.

Integrated patch antenna and electronics assembly and method for fabricating

A multi-board electronic assembly (10) includes a first substrate (12) and a second substrate (14) electrically connected by a spacer (16). The spacer (16) includes a first end (26) that is received in a first receptacle (18) on the first substrate (12) and a second end (28) that is received in a second receptacle (22) in the second substrate (14). The spacer (16) is formed generally of a nonconductive body (15) and includes ridges (60) and longitudinal channels (30) defined between the ridges (60). The ridges (60) are formed generally of a nonconductive material, and the spacer (16) includes a metallic strip (32) disposed within the channel (30). The metallic strip (32) forms a conductive path to connect the first circuit trace (20) to the second circuit trace (24) to form an electrically connected microelectronic assembly (10).

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Wayne, IL, United States of America

Jeffrey M Petsinger