Flx Micro, Inc.

Parker-hannifin Corporation

Case Western Reserve University

Jeffrey M Melzak

Chien-Hung Wu

Mehran Mehregany

Adel B Mansour

A force sensor utilizing force sensing element to generate an output signal that is commensurate with the force applied to the sensor. The force sensor includes a support element coupled to a resilient deflectable portion and at least one pivotable arm portion extending from the resilient deflectable portion; and a force sensing element supported by the base element and operably coupled to the at least one pivotable arm portion, wherein the force sensing element outputs an output signal that is proportional to a force applied to the at least one pivotable arm portion. The force sensor may be used a mass flow meter by coupling a fluid passage to the force sensor. The structure of the force sensor makes use of mechanical amplification to greatly increase the sensitivity of the sensor.

Low-power force sensor

MEMS structures that include silicon carbide micromechanical components, as well as methods of forming and using the same, are provided. The silicon carbide micromechanical components may be integrated on the same structure with electronic components that control or detect movement of the micromechanical components. MEMS structures of the invention may be used in a variety of applications including microsensor and microactuator applications.

Silicon carbide MEMS structures and methods of forming the same

Doped silicon carbide structures, as well as methods associated with the same, are provided. The structures, for example, are components (e.g., layer, patterned structure) in MEMS structures. The doped silicon carbide structures may be highly conductive, thus, providing low resistance to electrical current. An in-situ doping process may be used to form the structures. The process parameters can be selected so that the structures have a low residual stress and/or low strain gradient. Thus, the structures may be formed having desired dimensions with little (or no) distortion arising from residual stress and/or strain gradient. The high conductivity and mechanical integrity of the structures are significant advantages in MEMS devices such as sensors and actuators.

Doping of SiC structures and methods associated with same

An optic array connector is disclosed. The fiber optic array includes a first faceplate having a plurality of openings. The first faceplate is oriented in a first direction. The fiber optic array also includes a second faceplate having a plurality of openings. The second faceplate is oriented in a second direction. A plurality of optical fibers are inserted through the plurality of openings in the first faceplate and the plurality of openings in the second faceplate. The second faceplate and the first faceplate are adjusted such that a portion of the openings in the first faceplate and a portion of the openings in the second faceplate contact and hold the optical fibers.

Growing community of inventors

Beachwood, OH, United States of America

Jeffrey M Melzak