Lucent Technologies Inc.

Fitel USA Corporation

Alcatel-lucent USA Inc.

Jeffrey Linn Bream

Edwin Arthur Chandross

John Burnette MacChesney

Alan Michael Lyons

George J Shevchuk

Marcia Lea Schilling

Thomas Edward Stockert

Venkataram Reddy Raju

Stephen A Ferranti

Steven John Vargo

Leon Klafter

Madhu Ganesa-Pillai

John Paul Mello

Philip Habbauer

A tube take-up apparatus is provided to handle a length of freshly extruded tube. The apparatus includes an elongated housing in which a pair of parallel, spaced-apart rollers extend lengthwise in a position just below the extruded tubing. The housing is removably mounted on an elongated supporting fin which is secured to the extruder at its near end, extends upwardly between the two rollers and substantially along the entire length of the housing, and is, in turn, supported on a fixed pedestal at its remote end. After the full length of tubing has been extruded, the housing and rollers as a unit are lifted with the tube from the supporting fin and replaced by an empty housing, to extrude the next tube, while the full housing is carried away to a dryer.

Apparatus and method for handling extruded tubes

The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m&deg; C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.

Heatsink with high thermal conductivity dielectric

A holographic medium uses a photosensitive polymer medium. The shelf life of the photosensitive polymer medium is improved by hermetically sealing the polymer between glass plates. The hermetic seal is designed so that high T.sub.g materials, or solder, can be used as the sealant without damage to the polymer already contained between the plates. The hermetic seal comprises metal foils attached to the plates with the edges thereof extending away from the plates in tab-like fashion. The foils are attached prior to filling the assembly with polymer. After filling, the outer edges of the foil tabs are the sealed with local heating away from the site of the polymer, or crimped using mechanical crimping.

Holographic media

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Bethlehem, PA, United States of America

Jeffrey Linn Bream