Medtronic, Inc.

Motorola Corporation

Jeffrey L Galvin

David A Ruben

David Moon Yee

Lynn M Seifried

Craig L Wiklund

John E Nicholson

Thomas M Nutzman

Scott B Sleeper

Frederick J Robinson

Christopher T Kinsey

Bill R Simmons

Lourdes O Kline

A bonding tool for use in a laser bonding apparatus comprises an elongated body portion and a foot portion coupled thereto. The foot portion extends substantially transversely from the body portion and has a laser aperture and a guide channel therethrough. The guide channel is disposed between the body portion and the laser aperture.

Laser bonding tool with improved bonding accuracy

An implantable medical device including a hermetic housing containing an electronic circuit, such as a cardiac pacemaker. The electronic circuit may be coupled to a medical lead by means of a connector module which is formed as part of a molded, resilient shroud, extending around the circumference of the hermetic container.

Implantable medical device including a first enclosure portion having a

A dry etch process allows fabrication of very small SAW electrodes (less than 1 micron wide) on LiNbO.sub.3 (lithium niobate) or quartz substrates. In the process, analuminum (Al) layer is disposed on the substrate, and a photoresist layer is applied and exposed in the appropriate pattern. The wafer is then placed in an RIE where the Al is dry etched using a plasma containing chlorine and fluorine. The photoresist is then removed by an oxygen plasma. The oxygen also operates to replace the chlorine ions. By using this process, very precisely shaped electrodes can be formed.

Reactive ion etch process for surface acoustic wave (SAW) device

Growing community of inventors

Mesa, AZ, United States of America

Jeffrey L Galvin