Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Other

Jeffrey L Deeney

Joseph D Dutson

Richard John Luebs

Glenn Cochran Simon

David William Mayer

Richard E Olson

Laszlo Nobi

Stacy A Fraker

Michael Sturdevant

David W Peters

Jonathan W Craig

Jill H Quinn

An extendable and retractable support stand for holding a parked vehicle such as a motorcycle, bicycle or similar vehicle which is otherwise unstable in an upright position. The support stand has the ability to be locked into place without the need for fixed locking positions by means of a tilted plate locking mechanism that can be operated by the operator using only one foot irrespective of the orientation of the support stand. The support members may include an outer telescoping member pivotally attach to the vehicle frame, an inner support member, a support pad, a running clutch mechanism that automatically locks the telescoping members, and a refraction spring to automatically return the stand to the minimum length when the clutch mechanism is disengaged.

Vehicle support stand

A circuit board assembly having a circuit board and a column grid array ('CGA') integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a bottom surface. A frame surrounds the CGA integrated circuit package and is affixed thereto. The frame extends from the substrate to a portion of the circuit board when the column grid array integrated circuit package is mounted on the circuit board to support the column grid array integrated circuit package. The frame is affixed to the CGA integrated circuit package by adhesive after the CGA integrated circuit package is mounted on the circuit board, the adhesive accommodating any variations in height of the CGA integrated circuit package.

Method and apparatus for supporting a circuit component having solder column interconnects using an external support

A pin shroud for a circuit board having a raised pin platform and a pin array projecting from the raised pin platform. A spacer extending from a side wall of the shroud engages a side of the raised pin platform, thereby accurately aligning the pin shroud with the pin platform.

Pin shroud

A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board ('PCB') having a first side and a second side opposite to said first side; a heat sink arranged on said first side of said PCB; a first to-be-cooled component coupled to said second side of said PCB; and a thermal jumper to thermally couple said first component on said second side to said heat sink on said first side, said jumper being configured to extend physically around a side edge of said PCB.

Wrap-around cooling arrangement for printed circuit board

A circuit board assembly has a circuit board and a column grid array (&ldquo;CGA&rdquo;) integrated circuit package. The CGA integrated circuit package has a substrate having an array of solder columns extending from a bottom surface. An oversized lid is affixed to the substrate. Support shims are disposed between a portion of the lid that extends beyond an outer periphery of the substrate and a circuit board to which the CGA integrated circuit package is mounted. The support shims are affixed to the lid with adhesive after the CGA integrated circuit package is mounted on the circuit board. The adhesive accommodates any variations in height in the CGA integrated circuit package.

Method and apparatus for supporting circuit component having solder column array interconnects using interposed support shims

A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.

Support assembly for an integrated circuit package having solder columns

A circuit board assembly having a circuit board and a column grid array (&ldquo;CGA&rdquo;) integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a bottom surface. A frame surrounds the CGA integrated circuit package and is affixed thereto. The frame extends from the substrate to a portion of the circuit board when the column grid array integrated circuit package is mounted on the circuit board to support the column grid array integrated circuit package. The frame is affixed to the CGA integrated circuit package by adhesive after the CGA integrated circuit package is mounted on the circuit board, the adhesive accommodating any variations in height of the CGA integrated circuit package.

Method and apparatus for supporting a circuit component having solder column interconnects using external support

A support assembly useful for supporting an integrated circuit package having an array of solder columns extending to a circuit board when the integrated circuit package is mounted on the circuit board. The support assembly includes a support member for supporting the integrated circuit package and having a ramped surface. A biasing member associated with the support member couples the ramped surface to the integrated circuit package such that the support member resists downward movement of the integrated circuit package. The support member may include a plurality of support members with ramped surfaces which cooperate to raise a combined height of the support members. A related method of supporting an integrated circuit package is also provided.

Method and apparatus for supporting a circuit component

An integrated circuit device module comprises a printed circuit board having opposed sides, the printed circuit board comprising a portion carrying an area contact array on one of the sides of the printed circuit board. The module comprises an integrated circuit device having opposed, top and bottom surfaces, the bottom surface of the integrated circuit device comprising an area contact array for electrical communication with the area contact array on the printed circuit board. The module further comprises a clamping mechanism for compressively urging the area contact array on the bottom surface of the integrated circuit device into electrical communication with the area contact array on the portion of the printed circuit board, the forces applied by the clamping mechanism tending to deflect the portion of the printed circuit board and cause the area contact array on the bottom surface of the integrated circuit device to lose electrical communication with the area contact array on the integrated circuit device. A biasing structure is coupled to the printed circuit board for counteracting the forces applied by the clamping mechanism and the resulting tendency of the portion of the printed circuit board to deflect.

Land grid array integrated circuit device module

A column grid array integrated circuit package has a substrate. The substrate has a solder column array having a plurality of solder columns and a plurality of rigid columns interspersed with the solder columns at no-connect locations. The rigid columns contact a circuit board to which the column grid array integrated circuit package is mounted and support the column grid array integrated circuit package against compressive force.

Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columns

An integrated circuit device package in accordance with the invention comprises a first land grid array (LGA) interposer socket positioned between, and in communication with, an LGA integrated circuit device and a first side of a first circuit board; a second LGA interposer socket positioned between, and in communication with, a second circuit board and a second side of the first circuit board, wherein the second side of the first circuit board is opposite to and parallel with the first side of the first circuit board; and a clamping mechanism for compressively urging together the LGA integrated circuit device, the first LGA interposer socket, the first circuit board, the second LGA interposer socket, and the second circuit board into electrical interconnection under a predetermined load.

Integrated circuit device package including multiple stacked components

A thermal interface 26 between a heat source (e.g., an IC die) 24 and a heat sink 28 comprises a metallic mesh (26a) filled with a thermally conductive semi-liquid substance (26b). The thermally conductive semi-liquid substance may comprise, e.g., silicone grease or paraffin. The wire mesh may comprise silver, copper and/or gold cloth.

Electrically conductive thermal interface

A tape automated bonded circuit comprising a flexible substrate having an opening defined by a peripheral sidewall. A plurality of conductive traces are provided on the flexible substrate which terminate in a plurality of leads which extend into alignment with the opening. An electronic device having a plurality of pad regions is aligned with the opening in the substrate. The leads are bonded to the pad regions. A continuous encapsulation layer which touches the peripheral side wall of the substrate opening on all sides encapsulatingly covers the bonded leads and pad regions and structurally reinforces each lead along the entire length which projects over the opening.

Growing community of inventors

Fort Collins, CO, United States of America

Jeffrey L Deeney